【作者】 刘彦婷；

【导师】 吴兴坤；

【作者基本信息】 浙江大学 ， 光通讯技术， 2007， 硕士

【摘要】 如今是一个信息爆炸的时代，计算机和通信技术的快速发展为我们开辟了一个全新的世界。电子系统的信息处理能力与日俱增，但随着芯片工作频率的不断增加和线宽的不断缩小，人们也越来越清楚地发现互连技术已成为系统性能进一步发展的严重障碍。与电互连伴随的各种固有缺陷，如频率相关损耗、线路之间电磁干扰(EMI)和在高数据传输率时的串扰，不但限制了可用带宽，而且已成为限制系统表现的主要瓶颈。近年来，光学互连作为一种解决电互连存在的带宽问题的实施方案，引起世界许多研究机构的关注。在主板上的芯片与芯片间的通信系统中，光互连已经被证明拥有很大的潜力，具有传输速率快、能耗低的优点，并且在进行高速数据传输时的误码率极低。本文以研究层间垂直光耦合为目的，设计了一种新型多层光互连垂直耦合结构，可用于高速计算机内部垂直堆迭的多层连通光互连的芯片间光信息通讯；并且，将软光刻工艺应用于器件的制作，大大降低器件成本，简化制作过程，增加生产效率。本文的主要内容包括以下几部分：首先，介绍了当前光互连的基本情况，讨论了电互连方式的缺陷以及光互连方式的优点。其次，设计了一种新型的多层垂直耦合光互连线路，其结构简单，且具有较小的连接损耗(可低至0.05dB)。对四种不同的典型波导截面(分别为30×30μm~2，50×50μm~2，100×100μm~2，200×200μm~2)，在光学设计软件ZEMAX中进行了跨越1—6层的垂直耦合性能分析，发现当该结构的跨越高度与横向跨越距离的比值约为0.128时，可实现较理想的低损耗(＜1dB)光传输。最后，通过软光刻的方法制备了实际的多层互连线路，其测试性能得到的数据与理论结果基本相符。更多还原

【Abstract】 Today, we live in the midst of an information explosion. The rapid development of computing and communications technologies has opened an entirely new world. Although the ability of information processing of electronic system increasing steadily, the means of interconnecting these devices has remained relatively stationary, relying on conductive electrical lines. The performance of advanced electronic systems is increasingly limited by constraints imposed by interconnects and this limitation will inevitably become more serious as the operating frequency increases and the feature size reduces. Electrical interconnects suffer from problems such as frequency dependent loss, EMI and crosstalk at high data rates that limit the available bandwidth, and become the main bottleneck on the performance of systems.Optical interconnects have gained interest worldwide over the last years in view of their ability to offer a possible solution to the bandwidth problems associated with electrical interconnects. Optical interconnects, which have proven their potential in chip-to-chip communication systems on main boards, transport data faster, consume less power and transfer data more accurately at high data rates.A novel vertical coupling structure is designed for multilayered optical interconnect in this paper, one of most promising approaches for high speed communications in next-generation computer. In addition, we fabricate this newly designed interconnection using soft lithography technique, which can dramatically reduce cost, simplify production procedures and increase efficiency.First, the paper discusses the disadvantages of electrical interconnection and advantages of optical interconnection, and introduces the presently basic conditions of optical interconnection.Then, detailed design for the vertical coupling structure is followed. The layer-to-layer coupling features a simple structure with an insertion loss as low as 0.05dB. For four cross-sections of 30×30μm~2,50×50μm~2 , 100×100μm~2 , and 200×200μm~2 calculations for cross-over of up to 6 layers were performed using ray-tracing simulation tool ZEMAX, it was found that a low-loss coupling can be achieved as the ratio of cross height to traveling distance is about 0.128.At last, Prototypes were fabricated by using soft-lithography and measurement agrees with the calculated result in general.更多还原