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新型CPU集成热管散热技术研究

Investigation on New Integrated Heat Sink with Heat Pipes

【作者】 孙志君

【导师】 白敏丽;

【作者基本信息】 大连理工大学 , 工程热物理, 2006, 硕士

【摘要】 近年来,随着个人电脑CPU工作频率的增加和集成度的不断提高,使得CPU表面的热流密度急剧上升,因而CPU的散热问题已经成为制约其发展的瓶颈。热管作为一种高效传热元件,具有极高的导热性、优良的等温性、高散热效率和良好的环境适应性等特点,非常适合于小温差高热流密度条件下的散热。将热管技术应用于CPU的冷却,已经成为当前CPU散热的发展趋势。 本文首先对CPU散热技术和热管型CPU散热器的国内外研究进展及现状进行了综述;介绍了热管工作基本原理,并对其主要传热热阻进行了分析;针对目前市场上用于CPU冷却的热管型散热器存在的不足,提出了具有散热效率高、结构简单、形式紧凑、接触热阻小、重量轻、成本低等特点的两款新型热管散热器——单管扁曲型集成热管散热器和多管扁曲型集成热管散热器;利用CFD软件对上述两款散热器的外部流场分别进行了数值模拟,确定了单管扁曲型集成热管散热器的结构尺寸,同时通过对相同横截面面积的圆形和椭圆形两种热管的外部流场的数值模拟,证实了椭圆形热管的优越性,为多管扁曲型热管的结构确定指明了方向;在上述研究的基础上,加工制造了单管扁曲型集成热管散热器;根据国家关于电力半导体有关测试标准,建立了散热器性能测试试验台以及热管工质灌注系统;测试了单管扁曲型集成热管散热器的均温性以及不同充液量、不同工质以及不同风速对其传热性能的影响;测试结果表明,单管扁曲型集成热管散热器完全能够满足200W的CPU散热量。

【Abstract】 In recent years, with the increase in integral density and performance and the decrease in size for CPU of PC, heat flux is critically high. So the heat dissipation has become the bottleneck in development of CPU. As a two-phase heat transfer device, heat pipe can transport a considerate quantity of heat with a very small temperature difference from evaporation section to condensing section, so heat pipe is widely applied to the field of high heat flux due to its intrinsic merits such as superior conductivity, surface temperature uniformity, high efficiency of heat transfer and compact and adaptable structure, ect. Therefore, heat sink with heat pipes has become the trend of CPU cooling in the future.At first, the technology for CPU cooling and the development of heat sink using heat pipe for CPU were summarized in this paper. Then, the operating principle and the main thermal resistances of heat pipe introduced briefly. In view of the disadvantage of the heat sink using heat pipe for CPU cooling in the market, two new structure of heat pipe heat sinks were brought forward: single-tube flat-flexed integrated heat pipes [SFIHP] and multi-tube flat-flexed integrated heat pipes [MFIHP], which have many advantages, such as high heat dissipate efficiency, simple structure, low contact thermal resistances, light weight, low cost and so on. The method of CFD numerical simulation is employed to simulate the exterior fluid field of the two new types of heat pipe heat sinks and determined the structure and size of FBSIHP. At the same time, after the simulated to the exterior fluid field of the same cross section area round heat pipes and ellipse heat pipes which have equal cross section area. In conclusion, the advantage of the ellipse heat pipes was approved which point out the direction for the determination of the MFBSIHP structure and size.After the investigation about the heat pipe on the forward in the paper, one FBSIHP model was made. According to GB/T 8446.2-2004, an experimental system was established to test heat transfer performance of FBSIHP. A heat pipe filling system was set up also. The temperature uniformity of the surface of the FBSIHP and the influence in different working fluid filling, different working fluid and different air upwind velocities was tested in the paper. In conclusion, the tests show that the FBSIHP can adapt 200W CPU heat cooling completely.

  • 【分类号】TP332
  • 【被引频次】7
  • 【下载频次】1034
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