【作者】 姚绍宁；

【导师】 周汉义；

【作者基本信息】 合肥工业大学 ， 材料学， 2002， 硕士

【摘要】 本文主要论述了DSP芯片在高速多点并行测温系统中的应用。实现了一个以TMS320F240芯片为主要核心芯片的高速两点并行测温仪的研制。 本文首先介绍了测温仪器的发展及现状，提出用DSP研制高速多点并行测温仪的必要性和可行性。介绍了DSP芯片的发展、在各个领域中的广泛应用、DSP芯片的特点及如何开发DSP应用系统。 接着详细说明了为什么选择TI公司的TMS320F240作为本系统的DSP微处理器芯片，同时也解释了本系统其它部分芯片选择的原因。在考虑到系统将要实现的功能和所选择的芯片之后，给出了系统各部分的简略框图。 然后详细说明了本系统的研制过程，包括硬件设计、软件设计、抗干扰设计、制板和程序的编写等。 本文最后叙述了在调试过程中遇到的困难和解决办法，而且展望了本仪器的应用前景及可以进一步完善的地方。更多还原

【Abstract】 This paper discusses about the application of DSP in the high speed instrument to measure temperatures of many dots collaterally and the development of the high speed instrument with TMS320F240 to measure the temperatures of two dots collaterally.Firstly, it introduces the development and the present situation of the instruments to measure temperatures, brings up the necessity and practicability of development of the high speed instrument with DSP to measure the temperatures of many dots collaterally. And it also introduces the development of DSP, widespread applications on all area, the characters of DSP and how to development the application system of DSP.Secondly, it explains in detail why we choose TMS320F240, which is made by TI company, as the core chip of the instrument, and also explains why other chips are chosen. After considering the functions and the chips this instrument will achieve and use, we provide the simple frames of this system.Thirdly, it illustrates the process of the development of this system. It includes the designs of software, hardware and resisting interference, making the module and writing the programs.Lastly, h describes the difficulties met in debugging and ways to solve the problems. Moreover, it looks in the future of this instrument and brings up the parts to be improved in this system.更多还原