航空电子设备新型结构功能模块的热设计优化与实现

【作者】 冯文建；

【导师】 黄大贵；

【作者基本信息】 电子科技大学 ， 机械电子工程， 2010， 硕士

【摘要】 航空电子系统结构越来越复杂,综合化程度越来越高。综合化和模块化是构造先进航空电子系统的两条重要设计原则,模块化又是综合化必要的物理基础。结构功能模块集成制造技术课题正是为了解决模块集成制造中的一系列问题,研制高性能模块而诞生的。未来的航空电子设备向综合化、模块化、小型化、多功能化、高可靠性的方向发展,这将必然导致如散热、电磁兼容和接口互联等问题的出现。同时,电子设备的功能、体积、重量、可靠性以及对各种环境的适应性等被纳入结构设计的范畴,这给结构设计提出了更高的要求。随着电路集成度的提高,热流密度的增大,温度是影响电子设备可靠性最为关键的因素,因此本文以热优化设计为主线,同时解决结构功能模块集成制造问题。本文介绍了前期工作状况,包括模块标准的选用、热设计思路及流程、模块结构设计思路、液冷冷板、锁紧装置、起拔器、盖板、屏蔽板等。通过对前期模块结构优化设计,对比分析模块加工工艺方案,成功解决结构功能模块的制造和冷板焊接问题,提出了结构功能模块集成制造的方法。文中建立了结构功能模块的热设计测试系统方案,对模块进行了耐压试验测试、流量测试、热测试,提出了热试验结果的处理方法和计算公式,对比分析了热测试结果和仿真结果的差异,为其后的热优化设计提供了依据。以测试数据为基础,从功率器件的热布局优化、导流柱群的优化、热阻优化设计三个角度对结构功能模块液冷冷板进行了热设计优化。功率器件的热布局优化以结构功能模块实物模型和铝基功率板模型为基础,对比分析了功率器件不同热布局对器件温度和冷板散热性能的影响,优化得到了适合本项目的功率器件布局结构,并总结适合S型流道的功率器件布局方法；导流柱群的优化以热测试结果分析为基础,对冷板流道中的导流柱群的概念及优化思路进行了介绍,通过热仿真对比分析优化导流柱群,使冷板的散热性能和流体的压降损失达到平衡；热阻优化设计以提高热传导效率为思路,对比分析各个模型结构的热阻状况,对功率器件的热量传导路径优化,提高热量传导的效率,并提出了一种高效传热方案。文中对结构功能模块的集成制造方法、热测试对比分析、热阻模型分析方法、及热优化设计方法和思路可用于军民电子设备的热设计,对电子设备结构设计有重要的借鉴意义。同时,结构功能模块的研制对国防的建设有重大的战略意义。更多还原

【Abstract】 Avionics system architecture is becoming more and more complex, Integration degree is becoming more and more high. Modularization and Integration are two important design principles of advanced avionics system, modularization is the physical basis of the necessary integration. So the project of Integrated Manufacturing Technology of Multifunctional Structure is researched to solve problems and develop high performance module.The development of future avionics equipments and modules is to the integrated, modular, small, intelligent, multi-function, high reliability, easy maintenance and scalability direction. These will inevitably lead to many problems such as thermal, electromagnetic compatibility and interface connection. At the same time, the functions of electronic equipment, size, weight, reliability, and adaptability to various environments is included in the structural design. These present higher demand to structural designer.With the improvement of integrated circuit and the increased heat flux, temperature has become the main factor that affects the reliability of electronic equipment. So solving the problem of heat dissipation is the main thought to design the module in this paper and the project of Integrated Manufacturing Technology of Multifunctional Structure is researched to solve problems. The preliminary work is described in this paper, including the selection of standard modules, thermal design concept and process, the module structure of design ideas, liquid cooling cold plate, locking devices, insertion-extraction device and shielding board.To optimize the design of pre-module structure, comparative analysis module processing options for resolving the multifunctional module manufacturing and cold plate welding problem, Integrated Manufacturing Technology of Multifunctional Structure is researched. The thermal testing system program of structure and function module was established in this paper, Pressure testing、flow testing、thermal testing was done, the treatment of thermal testing results and formulas have been proposed, comparative analysis the differences of the thermal test results and simulation results,the basic of thermal designing optimization was provided.By the testing data, from thermal layout optimization of power device, optimization of diversion column groups, optimization of thermal resistance three perspectives on the multifunctional modules for liquid cooling cold plate thermal design optimization. The multifunctional modules and aluminum plate model was the basis of thermal layout optimization of power device, comparative analysis of the power devices with different layout of the device temperature and the thermal cooling performance cold plate, were optimized for the layout of the project’s power devices structure, and summarizes the flow for S-type power device layout method; The thermal testing results was the basis of diversion column groups optimization, Cold plate flow channel in the diversion column group concept and optimization of being introduced. The thermal simulation optimization of diversion column groups was to balance the thermal performance of cold plate and the pressure drop of fluid; The Purpose of optimization of thermal resistance was to Improve the efficiency of heat conduction, comparative analysis of the thermal resistance status of each model structure, the heat conduction of the power device path optimization to improve the efficiency of heat transfer, An efficient heat transfer scheme is proposed.The integrated manufacturing approach of the multifunctional modules, comparative analysis of thermal testing, thermal resistance model analysis, and thermal design optimization methods and ideas can be used for military and civilian equipment design in this paper, and has an important reference for structure design of electronic equipments. And it has a great strategic significance for national defense.更多还原