【作者】 张剑；

【导师】 吴文； 潘结斌；

【作者基本信息】 南京理工大学 ， 电子与通信工程， 2010， 硕士

【摘要】 接收机前端是雷达系统中的关键部件之一,它的主要功能是对雷达天线接收到的微弱信号进行处理,同时抑制来自外部的干扰和机内的噪声,使信号保持尽可能多的目标信息,因此其性能直接影响到雷达系统的整体性能。本课题旨在应用LTCC多层基板与封装一体化技术,实现X波段一体化接收前端的小型化技术研究,满足某型号工程的应用需求。论文首先对最近几年逐渐成熟的低温共烧陶瓷(LTCC)技术和应用进行了介绍。提出了基于一体化基板(LTCC)／外壳技术的X波段接收前端的小型化设计方案。然后对接收机的原理及几种常见的接收机的形式进行了描述,对微波有源电路如低噪声放大器、混频器、限幅器的原理进行了介绍；文中详细介绍了实现接收前端的几种关键技术,如对宽带金丝键合匹配结构、微波信号穿墙结构、微带-带状线-共面波导的转换等进行分析和仿真；X波段接收前端电路的封装采用一体化基板／外壳(ISP,Integral Substrate／Package)技术,将LTCC基板作为封装的载体,在LTCC基板上直接引出封装的I／O端子,并装连封装体的其他部分,使基板与外壳成为一个封装整体。最后将接收前端电路样品装配到X波段接收机系统中进行测试,测试结果表明,设计加工的一体化接收机前端电路满足了整机系统的设计指标要求,该X接收前端且具有可靠性高、体积小、重量轻、一体化封装、噪声低等优点。更多还原

【Abstract】 The receiver front module is one of important parts of Radar system. It could processs the feebleness signal received by the antenna, and also could restrain the outside interference & noises from inner part of the radar system, thus the system could help the signal holding more useful information. Its performance directly affects the Radar system’s work.The subject aims to apply the LTCC&Integral Substrate/Package (SIP) technology to achieve Miniaturization Research result of a X-Wave Band Integral Substrate/Package Front-end Receiver, thus to meet the practical demands of some engineering part.Firstly the paper introduced the characteristics and application of LTCC technology, which had become well-developed in recent years. A Miniaturization scheme of a LTCC substrate X wave band front end receiver design technology of ISP is presented. Then the paper talked about seveval typical receivers types and their working principles. Also, it described the working principles of several microwave active circuits, namely LNA、Mixer Limitr. The paper described in details several key technologies of front-end receivers:the anlysis & simulation technology of gold ribbon bonding adapted structure, microwave signal penetration structure, microstrip-stripline-CPW/coplanar wave guide switch. The X Wave band receiver adopt the Integral Substrate/Package (ISP) technology method, it take the LTCC substrate as the carrier of its package, with the I/O ports of the LTCC substrate directly led out,while assembling the other Parts of the package, in achiving a comprehensive package structure of the substrate and the package.Finally we assembled the front-end receiver into the X-band receiver system to measure. The measurement result showed that the front-end receiver module being able to reach the desired target value, and satisfying customer requirements. The module boasts of many virtues, such as high in reliability, small in volume, light in weight, low in noise, and integrated package.更多还原