【作者】 关昂；

【导师】 郭东明；

【作者基本信息】 大连理工大学 ， 机械制造及自动化， 2009， 硕士

【摘要】 单晶蓝宝石具有一系列优良的性能,莫式硬度高达9,在军事和民用领域具有广泛的用途。由于其硬度大,传统的平整化加工方法（研磨+抛光）存在加工效率低、难以实现自动化、污染环境等缺点,因此,国内外专家学者一直致力于如何实现单晶蓝宝石基片的高效、无损伤表面的超精密加工技术的研究。其中,采用固结磨料的超精密磨削技术是目前研究的热点,并已取得了显著的成果,但传统的金刚石砂轮磨削不可避免的会在单晶蓝宝石基片表面产生损伤,还需要后续的化学机械抛光去除损伤层,反而降低了基片的加工效率。针对上述问题,为了高效无损地加工单晶蓝宝石基片,本文提出了采用软磨料砂轮磨削单晶蓝宝石的加工方法,利用砂轮磨料、添加剂和单晶蓝宝石之间的固相化学反应和软磨料的机械摩擦作用实现单晶蓝宝石基片超光滑、低损伤磨削加工。根据单晶蓝宝石的物理化学性质,本文设计制造了超精密磨削单晶蓝宝石基片的软磨料砂轮,设计两个软磨料砂轮的组织成分,进行磨具的压制和软磨料砂轮的制造,并通过磨削修整试验,验证了两个软磨料砂轮的实用性;进行了磨料和单晶蓝宝石之间的固相化学模拟试验,模拟磨削过程中的固相化学反应,试验表明,MgO和Fe₂O₃磨料都可以与单晶蓝宝石发生固相化学反应,为软磨料磨削机理提供理论依据;进行了软磨料砂轮磨削蓝宝石基片的磨削性能试验,结果表明,使用软磨料砂轮可以实现对单晶蓝宝石的超精密加工,软磨料砂轮加工蓝宝石有比金刚石砂轮更优的加工性能,软磨料砂轮加工后的蓝宝石表面质量可达表面粗糙度Ra1.365nm,且软磨料砂轮可以实现更小的表面材料去除率,实现无损伤磨削;最后进行角度抛光试验,通过对单晶蓝宝石基片进行切割、粘片、研磨、抛光、腐蚀一系列流程,验证了软磨料砂轮磨削后的单晶蓝宝石基片是亚表面无损伤的单晶蓝宝石基片。更多还原

【Abstract】 Single crystal sapphire has a range of excellent performance, its Moh’s scale of hardness is up to 9, and has broad uses in the field of military and civilian. Because of its hardness, the formation of the traditional processing methods （grinding and polishing） have shortcomings as follows: low processing efficiency, difficult to automate and pollution environmental, therefore, domestic and foreign experts and scholars have been committed to how to achieve high efficiency and no damage surface of ultra-precision processing technology research on single crystal sapphire substrates. Among them, ultra-precision grinding technology using bonded abrasive is a hot research current, and has achieved remarkable results, but inevitably the traditional diamond wheel grinding will damage the surface of sapphire substrates, so it needs the follow-up of the chemical-mechanical polishing to remove the damage layer, thus reduced the substrate processing efficiency.To solve the above issues, in order to efficiently process single crystal sapphire in non-destructive manner, this paper presents a processing method using soft abrasive grinding wheel grinding single crystal sapphire, using solid-state reaction between grinding wheel abrasive, additives and single crystal sapphire and the soft abrasive’s mechanical friction to achieve ultra-smooth sapphire substrate, low-damage grinding. According to the physical and chemical properties of single crystal sapphire, this paper design and manufacture soft abrasive grinding wheel for ultra-precision grinding sapphire substrates, design the composition of two soft abrasive grinding wheel, carry out the conduct of repression and soft abrasive grinding wheel manufacturing, and through the grinding and dressing test, the practicability of the two soft abrasive grinding wheel is verified; carried out solid-phase chemistry simulation between the abrasive and single crystal sapphire to simulate the probably solid phase chemical reactions in grinding process, tests showed that, MgO and Fe₂O₃ abrasive can occur solid state reaction with single crystal sapphire, thus provides theoretical basis of soft-abrasive grinding mechanism; conduct a soft abrasive grinding wheel grinding sapphire substrate performance, test results show that the use of soft abrasive grinding wheel can achieve ultra-precision machining on the single crystal sapphire, the processing performance of soft abrasive wheel is better than diamond grinding wheel on grinding sapphire, after processing of soft abrasive wheel the sapphire surface quality the surface roughness is up to Ra 1.365nm, and the soft-abrasive grinding wheels can achieve smaller surface materials removal, realize damage-free grinding; at the end of the paper, angle polishing tests is carried out, by series processes of cutting, sticking film, grinding, polishing, corrosion the single-crystal sapphire substrate, verify the single-crystal sapphire after grinding of soft-abrasive grinding wheel is a non-destructive sub-surface, single-crystal sapphire substrates.更多还原