聚合物微流控芯片模内键合微通道变形研究

【作者】 蓝才红；

【导师】 蒋炳炎；

【作者基本信息】 中南大学 ， 机械制造及其自动化， 2009， 硕士

【摘要】 微流控芯片在生命科学、医学、化学、新药开发、食品和环境卫生监测等领域应用前景广阔,聚合物微流控芯片具有加工简单,低成本,易于批量生产等优点成为了研究热点,当前聚合物微流控芯片的成型工艺和键合工艺完全分开,自动化程度低,芯片制作周期长;本文对微流控芯片的模内键合技术展开研究,将为聚合物微流控芯片的注射成型和模内键合提供积累经验,为微流控芯片的批量、快速生产研究打下基础。首先,在聚合物粘合基础理论上从芯片键合力、表面张力和键合能出发,详细地分析了芯片的键合过程,在分析基础上提出微流控芯片的模内压缩键合方法,并对可行性进行了分析;研究了芯片键合应力、芯片表面质量、微通道变形和键合强度的产生原因及检测方法,研究表明基片和盖片的平面度对芯片键合应力和芯片表面微观质量影响较大,芯片表面洁净度主要影响到芯片表面微观质量,键合工艺参数影响微通道变形和键合强度。其次,设计对比了微流控芯片模内键合实验方案,并采用有限元法对1mm厚基片内宽0.1mm高0.04mm的微通道变形进行了仿真研究,结果表明:键合后微通道不能保持键合前的截面形状和尺寸精度,微通道的截面面积变小,其尺寸变化主要来于基片微通道尺寸向上凸起变形和盖片向下凸起两个方面,而微通道宽度尺寸基本保持不变;随着温度和压缩厚度增加,通道变形量增加,压缩厚度影响程度大于温度,微通道的变形随着盖片厚度的增加而减小,但减小变化不明显。再次,设计了一套芯片模内键合实验模具,实验研究了1mm厚的盖片和基片的芯片模内键合,对芯片键合面微观质量和通道变形进行了检测,实验结果表明,键合后芯片内部具有封闭微通道,证明可以模内压缩来键合芯片;微通道变形主要发生在高度方向,在宽度方向变形很小,微通道变形随着压缩厚度、温度和时间增加呈增大趋势,但影响程度不同,压缩厚度对芯片内微通道变形影响最大,要明显大于键合温度和键合时间的影响,与仿真结果得出的影响规律相同;键合面非键合缺陷随着键合工艺参数的升高而得到改善,压缩厚度和温度影响较大,时间影响不明显。更多还原

【Abstract】 The microfluidic chips were widly application in the field of life science, iatrology, new drugs exploitation,chemistry, foodstuff and enviroment inspecting etc.polymer microfluidic has been one hotspot of research because of its lower cost, simple produce procedure and easy for volume-producing. The conditional microfluidic chips manufacturing method were insufficient satisfied with the microfluidic manufacturing in large quantities for molding technology and bonding technology were compltely seperated. In this paper, the polymer microfluidic chips bonding in mold were introduced to solve the problems, and the research result will built the good foundation for microfluidic chips mass production.Firstly,the microfludic chips bonding force, surface tension of chips and bonding energy were introduced on the basic theoretics of polymer agglutination,and the microfluidic chips bonding process were analyzed in detail, the method of microfluidic bonding in mold were promoted , and the feasibility analysis of bonding in mold were studied .The cause and testing method of microfluidic chip bonding stress , bonding face micrcosmic disfigurement, microchannel ditortion and bonding intensity were presented. The study indicated that the flatness of substrate and cover plate influenced the bonding stress and bonding face micrcosmic disfigurement greatly, the lustration of chips affected the bonding face micrcosmic disfigurement,and bonding parameter played important roles in bonding intensity and the microchannel distortion.Secondly, microchannel distortion with the size of 0.1mm width and 0.04mm height in 1mm height substrate were studied by finite element softwre, results shows that the microchannel in substrate can not holding the cross-section shape and dimensional accuracy , the area of cross-section was decreased, the distortion of microchannel in height direction is more than width direction, and the dimensions of chip in width remain the same.The microchannel distortion increased with the compressed thickness and temperature increasement, the comprssed thickness affects the distortion more than temparature ,Microchannel distortion decreased with cover plate thickness increased ,but the decreasement is very small.Thirdly, A bonding mold was designed and the experiment of microfludic with 1mm cover plate was bonded in mold, then the bonding face micrcosmic disfigurement and microchannel distortion was detected.The study indicated that, there was a closed microchannel inside the microfludic, so the bonding method which comprssed mocroflucdic in mold was right.The micrchannel distortion mainly in height direction and the width direction was small,The distortion was increased with the increasement of compress thickness,temperature and time,and compress thickness affect the ditortion more than tempetature and time which was consistent to the simulation results,The experiment also indicated that increase the bonding parameters can improve the quality of bonding face micrcosmic disfigurement, the compress thickness and temperature affect the quality greatly ,and the bonding time affects the quality small.更多还原