【作者】 刘宏亮；

【导师】 干爱华； 曹宏斌；

【作者基本信息】 天津大学 ， 化学工程， 2008， 硕士

【摘要】 随着社会经济的迅速发展,电子产品的更新速度不断加快,给环境保护和资源回收带来了极大的压力。作为电子产品主要组成部分的线路板具有危害性和资源性的双重特点,开展有关废弃印刷电路板的回收处理技术的研究也就成为亟待解决的问题。本论文以废弃线路板为研究对象,将废弃线路板破碎后,采用多种检测手段分析废弃线路板组成,确定其资源特性;在传统机械破碎法的基础上结合化学溶胀法,对定制的标准板和废弃线路板中金属与非金属基板的强化分离进行了研究。实验过程中,使用溶剂D、溶剂F(溶剂D和F为实验室中自行配制的溶剂)和乙二胺等十种不同溶剂在一定温度和时间下浸泡定制的标准线路板,考察了不同溶剂浸泡条件对线路板铜箔与基板间剥离强度的影响,并筛选出四种有代表性的溶剂作为化学溶胀剂,即溶剂D、溶剂F、丙酮和水;比较了传统的机械破碎法和化学溶胀法处理线路板所需的破碎时间、颗粒的单体解离度、产品累计产率以及不同粒径下金属含量。研究结果表明:化学溶胀法能够大幅降低剥离强度,减少所需的破碎时间,在较短的时间内获得稳定的粒度分布,提高颗粒的单体解离度,溶胀剂的效果为:溶剂D>溶剂F>丙酮>水;浸泡时间越长,浸泡温度越高对剥离强度的降低越有利;使用溶剂D在150℃,3h或140℃,5h的浸泡工艺下,即可实现铜箔与基板的自动脱落。本文所研究的化学溶胀法处理废弃线路板,实现了线路板中金属与非金属基板的高效分离,操作简单,环境污染小,能耗低,溶胀剂可以循环使用,为后续分选回收奠定了基础,是一种环境友好、经济可行的物理回收技术,具有较强的实用性。更多还原

【Abstract】 Nowadays with the rapid development of social economy, electronic products are frequently upgraded, which continuously brings great pressure to the environmental protection and resource recovery. Discarded printed circuit boards (PCBs), as the main compositions of electronic products, have the double characteristics with harmfulness and resource. Therefore, the research on reuse, recycling and other forms of recovery of discarded PCBs is becoming an increasingly urgent task naturally.In this thesis, discarded PCBs were comminuted and characterized by several analytical techniques to make sure of the composition. On the foundation of traditional mechanical treatment, the separation process of metal and nonmetal in discarded PCBs and the ordered standard boards was studied by chemical swellings.In this experiment, PCBs were immersed in solvent D, solvent F(Solvent D and solvent F are both confected in the lab by ourselves.), ethylenediamine or other seven different solvents to study the effect of chemicals swelling on peel strength between the copper and main boards. Solvent D, solvent F, acetone, and water, were picked out as chemical swelling reagents in the experiment. The monomer liberation degree, the essential comminuting time aiming to get the certain size particles, accumulated yield and the contents of metal in particles with different diameters were all investigated after immersion using these four solvents respectively. It was shown that chemical swelling could significantly reduce the peel strength of metal and main boards, considerablely reduce essential comminuting time, get a constant particle distributing in a short time and improve monomer liberation degree of the particles. The effect of these solvents in turn is solvent D, solvent F, acetone, and water. The longer the time and the higher the temperature, it was more beneficial to decrease steel strength. In the condition of 150℃&3h or 140℃&5h using solvent D to dip PCBs, the copper would fall away from the main boards spontaneously.The disposals of discarded PCBs through the chemical swelling route depicted in the thesis exhibited high separating efficiency between metal and nonmetal boards, which laid foundation for latter sorting processes. In a word, the chemical swelling method is obviously characteristic of easier operation, less pollution, higher energy efficiency and recyclable solvents, which is an environmental benign, economically viable recovery technology with more practicability than traditional mechanical process.更多还原