【作者】 李泓杉；

【导师】 罗怡；

【作者基本信息】 大连理工大学 ， 微机电工程， 2008， 硕士

【摘要】 随着微电子产业和微机电系统的迅猛发展,元器件尺寸越来越小,对联结技术提出了更为苛刻的要求。产品的微小型化和多功能的集成,使得微小型产品在材料和技术上都是集成的、复杂的,因此微装配技术发挥着重要的作用。在微装配方法中微型零件的联结技术采用胶接剂粘结技术替代通用的螺纹等普通零件的联结方法。由于胶接技术不会破坏零件表面且联结后粘结表面应力分布均匀,已经成为微型零件的重要联结技术之一。微量胶接剂点样是微型零件胶接技术中的核心技术,它是一种通过可控的方式点样胶接剂的点样技术。本文从研究现有的点样方法出发,针对微量胶接剂的点样要求设计了实验装置。实验装置主要包括点样机械结构和自动挤胶控制两部分。本文分别采用高气压压缩气体和低气压压缩气体进行实验。当采用高气压压缩气体并增加小孔与玻璃基板的距离,难以准确控制胶点的点样位置。而采用低气压压缩气体进行实验并减小小孔与玻璃基板的距离,虽然可以实现胶点位置的准确点样,但是胶点的外形一致性差。对两次实验进行总结,利用实验中发现的胶接剂在点样针上流动并且在气体作用消失后具有触变回复现象,结合胶接剂的非牛顿流体特性、触变性和胶接浸润吸附理论。提出了一种新的切实可行的气动辅助针式点样方法。该点样方法克服了原有的针式转印技术点样胶点一致性差的缺点,并实现了在不更换点样针的情况下,通过改变点样针浸没胶接剂的深度和浸没胶接剂的时间,达到控制胶点直径大小变化的目的,而且能够满足胶点一致性良好的要求。更多还原

【Abstract】 With the high-speed development of Micro Electronic Mechanical System and micro electronics, the size of apparatus is becoming smaller and smaller. The requirement of coupling is not easy to deal with. The technology plays an important role in micro assembly system which is compositive and complex in materials. The method of bonding mini accessory is used in micro assembly system instead of traditional screw joint structure. Because bonding technology can not destroy the surface of accessory, the stress between joint interface is average, the bonding technology has become one of the most important connect methods. The micro dispensing technology is dispensing adhesive in a controlled way which is a key technology in micro accessory bonding.After studying dispensing system in existence, a system is developed to deal with micro dispensing. It includes mechanical system and control system. Do the research with high air pressure and low air pressure. It is hard to jetting exactly when in the condition of using high air pressure and long distance between hole and glass. The shape is unacceptable when using low air pressure and short distance between hole and glass.In conclusion, by analysing non-newton characters, thixotropy character and infiltration theory, we find out that adhesive will flow along the dispensing needle. We propose a new method of dispensing adhesive. The new method overcome the disadvantage of dot is not consistent in original way. By using the method proposed in this paper, it is easy to different size of dot without changing dispensing needle. It comes true by changing the depth of dipping into adhesive and the time of dipping. The shape and consistent is also acceptable.更多还原