电镀铜镍合金用阳极材料的研究

【作者】 曹文明；

【导师】 周伟良； 邵继南；

【作者基本信息】 南京理工大学 ， 应用化学， 2008， 硕士

【摘要】 本文在充分调研和研究阳极材料性能的基础上,针对拟定的铜、镍阳极材料,结合实验室赫尔槽实验和小型电镀生产线中试实验,选择无氧铜、含磷铜、镍圆饼、含硫镍和铜镍合金阳极,主要对两种铜镍合金镀液进行了试验研究。研究了阳极溶解情况、铜粉现象、镀液的电流效率、均镀能力、稳定性等性能。试验结果表明,三乙醇胺可和Cu⁺生成稳定的络合物,络合常数很大,导致镀液中产生大量的Cu⁺离子,进而生成铜粉。Cu⁺的存在导致铜优先沉积。三乙醇胺为主络合剂的镀液中镍阳极易产生钝化,不利于阳极溶解。三乙醇胺不宜用作无氰电镀铜镍合金的主络合剂和辅络合剂。NJKM-01对铜镍的络合性能虽无三乙醇胺高,但以NJKM-01为主络合剂的镀液不易产生铜粉,可实现铜镍共沉积。该镀液中使用无氧铜、磷铜角、镍圆饼、含硫镍等均可正常溶解,很少发生钝化现象。实验证明,从抑制产生铜粉的角度考虑,使用含磷铜阳极,特别是使用高磷铜（含磷量1.53%）铜阳极可有效抑制铜粉的产生。在长时间电镀后,添加双氧水使镀液中积累的少量Cu⁺氧化成Cu²⁺,可明显改善阴极镀层质量。本文对不同配方改变工艺条件进行了试验,探讨了温度、电流密度、搅拌速度（滚桶转速）等对试验结果的影响。经优选,经优选,使用阳极篮表面积分别为40.5dm²磷铜角（套阳极袋）和40.5dm²镍圆饼阳极,铜、镍阳极电流分别使用30A和30A的情况下,能生产出符合工艺要求的电镀铜镍合金坯饼,电镀工艺稳定。为我国的造币业提供了一种新的选择,具有深远的实际意义和应用前景。更多还原

【Abstract】 On the basis of investigating and studying the characters of the positive pole,the text studies the reacting effects of the liquid where electroplating Copper-Nickel alloy through Heecao test and small electroplating line test using many materials as positive pole,such as non-oxidized copper,copper including phosphorus,nickel pancake,nickel including sulphur and Copper-Nickel alloy.In this research,it studies the dissolving state of the positive pole,copper power,electric current efficiency,the capacity of even electroplating,and stability.The result indicates that it produces a lot of Cu⁺ and copper power next in the electroplating liquid because the complexing constant of complex agents created from triethanolamine and Cu⁺ is large.Cu⁺ makes copper deposit preferentially.Tin as positive pole is blunt easily and it is bad for positive pole to dissolve in the electroplating liquid where triethanolamine is main complex agent,triethanolamine is unsuitable for main complex agent and subsidiary complex agent to electroplate Copper-Nickel alloy.NJKM-01’s function to complex copper and nickel is not better than triethanolamine’s,but it produces few copper power and can make copper and nickel deposit simultaneously in the electroplating liquid where using NJKM-01 as main complex agent,non-oxidized copper,copper including phosphorus,nickel pancake,nickel including sulphur can dissolve and are not blunt easily. The research proves that using phosphorus-copper,especially copper including phosphorus of high rate （1.53%）,can restrain the production of copper power efficaciously.After long electroplates,it can improve the quality of electroplating layer of negative pole that add H₂O₂ to make the few Cu⁺ oxidtze Cu²⁺.The text studies that different directions change craft conditions in the research and approaches that temperature,the density of electric current,the steep of stirring affect the result of research.through selecting preferentially,on the situation of using copper including phosphorus and nickel pancake as positive pole,and electric current being both 30A and 30A,it can produce coin pancakes electroplated Copper-Nickel alloy which satisfy the demand of craft.This provides another choice for minting career in our country,and it has actual significance and applied future.更多还原