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豆胶杨木刨花板的工艺及特性研究

Study on Technology and Speciality of Soy Adhesive Particleboard

【作者】 袁少飞

【导师】 张洋;

【作者基本信息】 南京林业大学 , 木材科学与技术, 2008, 硕士

【摘要】 目前生产刨花板常用的三醛胶,来源于不可再生的石油资源,在生产及使用过程中会释放对人体及环境有害的甲醛物质。因此,研究环境友好型生物质胶粘剂豆胶在刨花板中的应用具有重大的生态效益和环保意义。本课题研究的内容和结论如下:豆胶的DSC分析表明:其主要热反应是在160℃以下完成的;升温温度越高,其出现的停顿点也较多;温度越高,越有利于豆胶的固化。通过正交试验结果表明:施胶量对豆胶刨花板的性能影响最显著,豆胶刨花板热压的最佳工艺是:施胶量为12%,热压温度为180℃,热压时间为8min,压力为4MPa。豆胶刨花板经贴面后的防霉性能最好,其次是进行防霉剂表面涂刷的豆胶刨花板,而防霉剂在拌胶时加入板坯中的豆胶刨花板防霉性能较前两者较差。而不同防霉剂对豆胶刨花板的防霉性能影响研究表明:硼酸锌和防霉剂-X的防霉效果比铜唑和TBQ-M好。豆胶刨花板在热压过程中不同因素对板坯芯层的温度变化影响是:在快速升温段,提高热压温度和增大初含水率均能加快板坯的升温,目标厚度小或目标密度低的板坯升温速率更快;在水分集中汽化段,通过提高热压温度和减少板坯含水率均能缩短汽化时间,目标厚度小或目标密度低的板坯汽化时间更短。热压温度对豆胶刨花板贴面的浸渍剥离性能和表面胶合强度的影响最为显著;豆胶刨花板贴面的最佳工艺为:热压温度130℃,热压时间4min,单位压力1.2Mpa,涂胶量200g/m~2。

【Abstract】 Presently the more commonly used resins in particleboard industry are UF, PF and MUF. However, these resins are derived from non-renewable oil resources, and will release toxic formaldehyde in its producing and using. So, there is much interest in developing environmental friendly bio-based adhesives in the particleboard. The main research contents and results were as the following.The DSC of soy adhesive proclaimed that the main soy adhesive thermal reaction accomplish below 160℃; The more high temperature, the more standstill points; the high temperature is advantageous of soy adhesive solidify.Through orthogonal experiment, the test results proclaimed that resin content have significant influence on the soy particleboard properties.The optimal physical and mechanical properties of particleboard was obtained with resin content 12%, hot-pressing temperature 180℃, hot-pressing time 8min, hot-pressing pressure 4MPa.The antimould is the best after the soy adhesive particleboard veneer, secondly painted surface with antimould-agent, finally joined the board, the effect of zinc borate and antimould-agent-x are better than TBQ-M and copper azole.The influence on the temperature changes of the corn process of the factors: if hot-pressing temperature or the mat moisture content increases during the rapidly rising temperature stage,the rate of increasing temperature will accelerate,the rate of acceleration in thin or low density board is very high. During the moisture vaporizing stage the time used to vaporize moisture can be shortened by increasing hot-pressing temperature or decreasing the mat moisture content.In thin or low density board this time period is short.The hot-pressing temperature have significant influence on the peel strength and the interfacial bonding strength, the most appropriate condition for veneer technics is: hot-pressing temperature 130℃, hot-pressing time 4min, hot-pressing pressure 1.2Mpa, glue spreading amount 200g/m~2.

  • 【分类号】TS653
  • 【被引频次】3
  • 【下载频次】331
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