【作者】 陈省区；

【导师】 王德苗；

【作者基本信息】 浙江大学 ， 物理电子学， 2008， 硕士

【摘要】 当今社会电磁污染变得日益严重,而塑料在电子产品封装上的广泛应用也从另一个方面加重了电磁污染,随着世界各国关于电子设备的电磁兼容标准和法规的出台,对电子产品进行电磁屏蔽设计已成为必然趋势,塑料机壳的电磁屏蔽已成为国际上热门的研究课题。本文从理论和实验研究两个方面研究了塑料机壳的电磁屏蔽膜,设计并成功制备了多层膜系结构的屏蔽膜,论文取得的成果和创新点在于:（1）从经典的传输线理论出发,推导出了与S.A.Schelkunoff电磁屏蔽理论相符合的屏蔽效能理论计算公式,并据此仿真设计了多层、夹层结构的屏蔽膜系结构。（2）采用磁控溅射技术成功地在PET基底上制备出附着力大于500 kPa、在2 GHz～4 GHz范围内屏蔽效能大于60 dB的多层膜系结构的电磁屏蔽膜;通过实验提出400 nm Cu/160 nm 1Cr18Ni9Ti最佳双层膜结构,这一结构经济实用,完全能满足实际应用的需求;在保持屏蔽膜总厚度不变的情况下,夹层结构的屏蔽膜层可以有效提高屏蔽效能,提高幅度达到10 dB。实验结果与理论设计值也较为吻合,表明所推导研究的屏蔽效能理论计算公式有较大的应用价值。（3）通过湿法喷砂或等离子处理工艺,增加塑料表面的活性与机械铆合作用,使金属Cu膜和塑料的附着力达到500 kPa以上,提高幅度达到37%,这一工艺对产业化应用有重要实用价值。（4）提出了用波导法通过测量S₂₁参数来测量金属抗EMI膜的屏蔽效能的测试方法,实现了薄膜屏蔽效能的快捷、准确测试,有实用价值。这一方法在国内尚未见报道。更多还原

【Abstract】 Nowadays electromagnetic pollution is becoming worse and worse, and the abroad application of the plastic in the package of electronic products also aggravates the pollution. With the electromagnetic compatibility standards and regulations of electronic equipments being promulgated by most countries, it’s becoming a trend to do the design of electromagnetic shielding. And the electromagnetic shielding of plastic package has become internationally popular research topics.In this paper, we researched on the electromagnetic shielding films of plastic package from both theoretical and experimental aspects. We successfully designed and deposited various kinds of metal films for shielding on the plastic PET by magnetron sputtering. The major works and innovation in this paper are as follows:（1） We deduced the formula for shielding effectiveness using the classic transmission line theory, which complies with the S.A.Schelkunoff theory of electromagnetic shielding. And we simulated and designed shielding films with multi-layers and sandwich structure from the formula.（2） We deposited various kinds of metal films for shielding with an adhesion of more than 500 kPa and a shielding effectiveness of more than 60 dB between 2 GHz and 4 GHz on the plastic PET by magnetron sputtering; we put forward optimal anti-EMI metal films of 400 nm Cu/160 nm 1Cr18Ni9Ti through experiments, which can meet the needs of practical use; it was proved that shielding films with sandwich structure with the same total thickness can greatly improve the shielding effectiveness by about 10 dB. The experiment results complied with the theory design very well, which indicated that the deduced formula for shielding effectiveness had very important practical value.（3） We increased the plastic surface roughness and activity with a riveting effect by means of sandblasting or plasma processing-cleaning. As a result, the adhesion of Cu film and plastic had reached more than 500 kPa and been greatly enhanced by 37%. And this technology has important practical applications in the process of industrialization.（4） We put forward the waveguide to measure the shielding effectiveness by measuring the parameter S₂₁ of Anti-EMI metal films, which was fast, exact and practical. And this method has not been reported domestically.更多还原