【作者】 高珺；

【导师】 雷明凯；

【作者基本信息】 大连理工大学 ， 材料加工工程， 2007， 硕士

【摘要】 利用双室高真空多功能磁控溅射装置，在背底真空优于2×10^-5Pa、溅射Ar气气压0.3 Pa、溅射功率100 W的条件下，以30 mm×3 mm×380μm的Si（100）为基体，室温直流溅射沉积设计调制比为1、设计调制周期为5-40 nm的Fe/Cu纳米多层薄膜。利用小角/广角X射线（SA/WAXRD）和高分辨透射电子显微镜（HRTEM）分析Fe/Cu纳米多层薄膜的成分、相结构和界面结构等调制结构。利用表面轮廓仪和纳米压痕仪测量Fe/Cu纳米多层薄膜残余应力和纳米硬度。测定的Fe/Cu纳米多层薄膜的调制比约为1，调制周期为5.63-34.0 nm，与设计值吻合。在各调制周期下，Fe/Cu纳米多层薄膜界面清晰，近基体平直，后渐呈波浪状，基体与多层薄膜之间存在2 nm厚的非晶层。Fe亚层为具有（110）择优取向的bcc-Fe，Cu亚层为具有（111）择优取向的fcc-Cu。调制周期为5 nm的Fe/Cu多层薄膜的界面局部存在共格，Fe亚层为体稳定bcc-Fe，Cu亚层为体稳定fcc-Cu与亚稳bcc-Cu交替变化的结构。两种亚层的晶粒均为贯穿亚层生长的柱状晶，调制周期由5 nm增至40 nm，平均晶粒尺寸由5 nm增至19 nm。Fe/Cu纳米多层薄膜的残余应力为张应力，沉积后随时间的变化释放不显著，调制周期由5 nm增至40 nm，残余应力由183 MPa增至627 MPa，主要归因于晶粒尺寸的变化和热失配的作用。Fe/Cu纳米多层薄膜的硬度随调制周期由5 nm增至40 nm，先增大后减小，调制周期10 nm达到峰值7.29±0.29 GPa。Fe/Cu纳米多层薄膜亚层的模量差异和亚层的互混程度决定多层薄膜的硬化性能。更多还原

【Abstract】 Fe/Cu nanometer-scale multilayers with nominal modulation wavelengths ranging from 5to 40 nm and alternating Fe and Cu sublayers thickness ratio 1:1 are direct current sputteringdeposited onto single crystal Si （100） substrates with dimensions of 30 mm×3 mm×380μmat room temperature using the high-vacuum duplex chamber multi-functional magnetronsputtering apparatus with a base pressure better than 2×10^-5 Pa. The working pressure ofresearch-grade Ar and the target power are 0.3 Pa and 100 W, respectively. Modulationstructures including concentration profile, phase state and interfacial structure arecharacterized by using small angle / wide angle x-ray diffraction （SA/WAXRD） and highresolution transmission electron microscopy （HRTEM）. Residual stress and nanoindentationhardness are examined by using profilometry and nanoindentation, respectively. The actualsublayer thickness ratio is close to 1:1, and the actual modulation wavelengths are 5.63-34.0nm, which agree with the designed values. Fe/Cu nanometer-scale multilayers have clearinterfaces between the alternating Fe and Cu sublayers which are planar near the substrate andwaved near the surface. There is an amorphous layer with a thickness of 2 nm betweenmultlayers and substrate. In all conditions, the multilayers have Fe （110） and Cu （111）textures. For the multilayers with nominal modulation wavelength of 5 nm, the crystalstructure of Fe sublayers is bcc, and the one of Cu sublayers is alternative stable bcc andmetastable fcc. The columnar grains of Fe and Cu grow through the sublayers, and theaverage grain size increases from 5 to 19 nm with increasing the modulation wavelength from5 to 40 nm. The tensile residual stress in the Fe/Cu multilayers which relaxes insignificantlyincreases from 183 to 627 MPa with increasing the modulation wavelength from 5 to 40 nm.The evolution of the residual stress is interpreted by the increasing grain size. Thermal misfitsignificantly contributes to the residual stress. The hardness of the Fe/Cu multilayersincreases firstly and then deceases with increasing the modulation wavelength, and reachespeak value of 7.29±0.29 GPa at the nominal modulation wavelength of 10 nm. The evolutionof the hardness of the multilayers depends on layer miscibility and modulus differencebetween sublayers.更多还原