【作者】 毛建；

【导师】 王钧；

【作者基本信息】 武汉理工大学 ， 材料学， 2006， 硕士

【摘要】 环氧树脂因其具有良好的工艺性能、机械性能、粘接性能、电气性能和耐化学药品性能，而广泛应用于涂料、胶黏剂、电子电器材料、工程塑料和复合材料、土建材料等领域，在热固性树脂中处于主导地位。随着现代化工业的发展，对材料的性能提出了越来越高的要求，低成本、高性能是材料研究与应用的中心课题。其中，提高环氧树脂的耐热性以及韧性是环氧树脂面临的重要课题。 本文认为环氧树脂的耐热性能由其官能团提供，提出“耐热因子”这一概念，并建立了相应的耐热数学模型。通过SPSS统计软件对耐热模型进行分析，并验证该模型的正确性。 研究结果表明：不同官能团对环氧树脂的热贡献不同，即官能团的“耐热因子”不同。环己烯基、苯环和三嗪核骨架的耐热因子分别为2.026（℃·L／mol）、19.487（℃·L／mol）、39.439（℃·L/mol）。环氧树脂共混体系的耐热性可表示如下： Tg=a₀+a₁A+b₁B+c₁C+… 其中，a₀为常数，等于35.546℃；a₁、b₁、c₁分别为不同官能团A、B、C的耐热因子，单位为℃·L/mol：A、B、C…为耐热基团含量，单位为mol／L。 本文通过硬质链段接枝增韧环氧树脂。研究了硬质链段接枝增韧环氧树脂的机械性能，分析了增韧剂的增韧效果以及增韧后固化物断面的显微结构。 研究结果表明：对于通常环氧树脂，当JY—1加入量为15％，JD—1加入量为30％时，提高幅度分别为原来的35.7％，42.9％。其增韧效果明显，达到国外某品牌X—13，X—16增韧效果。对于耐热环氧树脂，增韧剂的加入量最好不要超过15％。更多还原

【Abstract】 Epoxy resins have been extensively used in paints, adhesives, electronic and electrical materials, engineering plastics, composite materials and structural materials owing to their many attractive properties, such as excellent physical and mechanical properties, good thermal and electrical properties and excellent anticorrosive performance. Up to now, research efforts on improving epoxy resins’ properties are still attractive for advanced applications with the development of modern industry. Low cost and high performance are the central task in material research and application. To improve thermal properties of epoxy resins is an important task in it.It’s supposed that the thermal properties of epoxy resins are contributed by functional group and there is "thermal factor" brought forward and mathematical thermal model just established in this article. The thermal model has been analyzed through SPSS statistic software and check correctness of the model as well.The results show that the thermal contribution to epoxy resin is different because of various functional groups. Namely different functional groups have different thermal factors. The thermal factors of cyclohexenyl, benzene ring and triazinyl are namely 2.026（℃·L/mol）, 19.487（℃·L/mol）, 39.439（℃·L/mol）. The thermal properties of epoxy resin blend system can be expressed below:Tg=a₀+a₁A+b₁B+C₁C+...That’s, a₀ is constant equaling to 35.546℃. a₁, b₁ and c₁ are the thermal factors of functional group A, B and C, with unit ℃·L/mol. A, B and C... are the contents of thermal functional group, with unit mol/L.It’s discussed that horniness segmer graft toughen epoxy resin in this article. The mechanical properties of horniness segmer graft toughening epoxy resin, toughening effect and microstructure of the fracture surface of toughened condensate have been studied on.The results shows that, for common epoxy resin, the toughness has been improved by 35.7% and 42.9%, when JY— l’s addition at 15% and JD-1 at 30%. It’s obvious in toughening, which just reach foreign toughener X—13 and X—16. For high temperature epoxy resin, it’s best not more than 15% that the quantity added to epoxy resin.更多还原