多芯片组件热分析及热设计技术研究

【作者】 谢劲松；

【导师】 钟家骐；

【作者基本信息】 电子科技大学 ， 精密仪器及机械， 2005， 硕士

【摘要】 对于某多芯片组件，其工作在高温、高湿等恶劣环境中，要求IC芯片及功率元件有很高的可靠性，多芯片组件(MCM)热分析及热设计的研究是提高其可靠性的关键。因此，对多芯片组件的热分析及热设计是十分必要的。本论文利用有限元软件(ANSYS 8.0)对多芯片组件进行了热分析，以准确、快速的热分析方法评估了该多芯片组件的热特性及各种封装参数对其热特性的影响，提出了改善多芯片组件散热特性及提高其可靠性的方法：论文还利用ANSYS 8.0对大功率多芯片组件进行了热分析，同时，提出了改善大功率多芯片组件散热特性的六种热设计方案。本论文所做的主要工作如下： 1、针对不同外界环境及不同封装参数下的多芯片组件，利用有限元热模拟技术分析了它的三维温度场，得到了影响该多芯片组件热特性的一些重要因素，这些因素包括封装底板底面的温度、粘接层的导热系数、基板材料的导热系数、封装底板的导热系数、芯片的功率密度及外界环境等。 2、针对大功率多芯片组件，利用有限元热模拟技术分析了多芯片组件的温度场，通过循序渐进的方法，提出了六种热设计的方案。这六种热设计的方案为改善大功率多芯片组件的散热特性及提高其可靠性提供了参考。这六种热设计方案包括：(1)改进封装参数；(2)采用散热铜柱及铜散热器；(3)改进铜散热器的结构；(4)直接水冷却；(5)强制空气冷却；(6)间接水冷却。其中，强制空气冷却方案及间接水冷却方案应用了有限元的热—流体耦合模拟技术。 3、通过对多芯片组件的热分析及热设计，为多芯片组件的设计提供了可靠的热分析、热设计数据及方法，具有一定的指导意义和应用价值。更多还原

【Abstract】 The thermal analysis and design of multi-chip module (MCM) are very important and indispensable because these are the key step to raise the reliability of multi-chip module, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of MCM with the help of the finite element software(ANSYS 8.0) to evaluate nicely and quickly the thermal performance, which is deeply influenced by packaging parameters, and puts forward the methods to improve the radiating performance and reliability of MCM, Moreover, the thesis presents six projects that improve the radiating performance of large-power MCM on the basis of analyzing the thermal performance of large-power MCM using the software (ANSYS 8.0). In general, the main work of this thesis follow as:1. Has obtained the main influencing factors of thermal performance of MCM under different outer circumstances and packaging parameters on the basis of analyzing the 3-D temperature field of this MCM in virtue of finite element thermal simulation technique, which involve the temperature on the ground boar of packaging, the conductivity factors of cementation layer, the material of base plate and the ground plate for packaging, the power density of chip and the outer circumstances.2. Has put forward six kinds of projects of thermal design for large power MCM by way of analyzing the temperature fields of MCM using the finite element thermal simulation technique step by step. These projects, which provide good references for improving the reliability and radiating performance of large-power MCM, include: (1) the improving of packaging parameters; (2) the adoption of radiating copper-pole and the copper radiator; (3) the improving of structure of copper radiator; (4) the direct water cooling; (5) the forced cooling of air convection; (6) the indirect water cooling. There-into, the projects (5) and (6) adopt the finite element simulation technique of thermal-fluid coupling.3. The thesis provides reliable data and methods for thermal analysis and design of MCM and has certain value of guidance and application.更多还原