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空空导弹电子本体特种料真空树脂灌封关键技术的研究

Research on Vacuum Resin Dosing Technology Applying in Electronic Body and Special Material of Air-To-Air Missile

【作者】 刘延霞

【导师】 温何;

【作者基本信息】 西安理工大学 , 机械电子工程, 2005, 硕士

【摘要】 我国高新技术发展在国防科技工业中正发挥着越来越大的作用,空空导弹是国防装备技术之一,而电子本体和偏转线圈是空空导弹中不可缺少的部件,为了使空空导弹电子本体和偏转线圈长期保持高性能,则需对其进行灌封处理。本课题结合实际的项目进行了灌封技术的研究。 作为技术难点,作者对粘性环氧料灌封电子本体技术进行了详尽地研究和试验。以粘性流体力学等理论为基础,利用ANSYS对电子本体内的粘性流体进行简单的仿真,在此基础上推断利用超声波高频振动降低流体的粘度,提高其流动性,以便对灌封进行有效的控制。 在特种灌封料灌封偏转线圈技术的研究中,针对特种料的强腐蚀性和强毒性对灌封设备中管接头和球阀进行了密封设计;真空度直接影响了电子本体和偏转线圈的灌封质量,故本文对灌封设备真空静密封进行了一定的研究与设计。 高粘度的环氧树脂和特种料对温度都比较敏感,只有在一定温度下才能保证其合适的流动性。本文将FX2cPLC、常规PID方法和专家系统产生式控制规则有效地结合成智能PID控制器,实现了对系统温度的精确控制。

【Abstract】 The development of Hi-Tech industry attract our notice on its more and more important function on National defence industry, and air-to-air missile is a kind of equipment of National defence. Electronic body and deflecting coil are indispensable parts in air-to-air missile. In order to keep their high performance for a long time, we had to deal them with cast resin. This thesis undertakes the technology research of cast resin connecting with fact item.As technical difficulty, the author makes experiment and undertakes research on the technology of dosing electronic body detailed. Based on viscous hydrodynamics, the author simulates simply the flow filed inside electronic body by ANSYS, and then uses ultrasonic high frequency vibration equipment to improve its fluidness. Thus we can carry out effectively control to cast resin.In the technology of dosing deflecting coil, special material as solid reagent of resin is one kind of intensional caustic reagent. Author does some design on tube union and ball valve aiming at that. Vacuum level directly influences on the quality of cast resin, so author makes some design on vacuum static seal in this thesis.High viscosity E-51 resin and special material are both sensitive totemperature, and the good fluidity of potting compound is guaranteed in suitable temperature. The author adopts intelligence PID control strategy in the basis of FXhPLC that programmed combining general PID with production rules of expert system, then the system can be completed precise temperature control.

【关键词】 电子本体特种料灌封密封温度控制
【Key words】 electronic bodyspecial materialcast resinsealtemperature control
  • 【分类号】TJ762.23
  • 【被引频次】1
  • 【下载频次】192
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