【作者】 温敏；

【导师】 王晓东；

【作者基本信息】 大连理工大学 ， 机械制造及其自动化， 2005， 硕士

【摘要】 微流控芯片是微全分析系统（Miniaturized Total Analysis System,μTAS）的主要研究方向,在生命科学、医学、化学、新药开发、食品和环境卫生监测等领域应用前景广阔。聚合物材料具有加工简单、低成本、易于实现批量生产等优点,本文研究了塑料微流控芯片微通道的热压成形和芯片的键合工艺,制作了微流控芯片,实际应用于药物分离检测。 对微通道热压成形过程中,塑料力学性能对时间、温度的依赖性进行了研究,采用弹簧、粘壶的组合模型分析了塑料在玻璃化温度附近的粘弹性行为特征。 在分析塑料玻璃化温度附近的流变行为基础上,研究了微通道热压过程中的材料传热数学模型、应力场分布数学模型。根据应力场分布的数学模型,应力在芯片的分布不均匀,中央最大,边缘最小。随着热压冷却阶段压力的提高,应力分布的不均匀对降温脱模后的微通道不一致性的影响将有效地降低。 进行了塑料微流控芯片微通道热压成形工艺试验,研究了温度、压力和时间3个可控因素对微通道热压成形质量的影响。提出了试验确定微通道热压成形工艺参数的方法,并确定了选用材料的热压工艺参数,在该工艺参数下热压获得的芯片微通道复制精度高,片内不一致性小于5%。该试验方法对不同厂家材料微通道热压成形工艺参数的确定具指导意义和实际应用价值。 研究了塑料微流控芯片基片和盖片的键合方法,对键合前PMMA芯片进行了表面预处理,采用热粘合法实现了PMMA芯片的键合。键合质量经测量,键合强度不低于0.1Mpa。键合后的芯片在20mmol/L的硼砂缓冲溶液中,微通道的伏安特性的线性段为2000～6000V,电渗流为2.8×10^-4cm²V^-1S（-1）。芯片用于电泳分离安非他明-FITC衍生溶液,峰高RSD为4.4%（n=6）,理论塔板数为11.4×10⁴m^-1。此外,试验了溶剂粘合法进行塑料微流控芯片的键合,键合强度大于热粘合法。更多还原

【Abstract】 The Microfluidic Chips is the main research orientation of Miniaturized Total Analysis Syatem (uTAS). It’s widely application in the field of life sciences, iatrology, new drugs exploitation, chemistry, foodstuff and environment inspecting etc. Polymers represent certain advantages such as process simple, normally low cost and esay to high volume production. In this dissertation, hot embossing and bonding techniques were researched for fabrication plastic Microfluidic Chips. The drug was detected on the Microfluidic Chips produced by this method.In hot embossing polymers microchannels, the material was processed near the glass transition temperature. The viso-elastic behaviors of material are studied by parallel model combined with spring and viscous dashpots. It’s found that polymer’s mechanical properties behave strongly in time and temperature dependent manner.After discussing flow behaviors of polymers near the glass transition temperature, the mathematical model of heat transmission through thermal medium and the mathematical model of pressure distribution within polymer were studied. This finding indicates that a non-uniform pressure distribution in the radius direction produced by embossing processl. However, a higher embossing pressure during cooling leads to a more uniform shrinkage in the elastically deformed. And thus reduces the variation of microchannel.Experiment on hot embossing microchannels was carried out. Embossing parameters temperature, embossing force and time governing hot embossing were investigated. An experiment method was put forward to establish PMMA microchannels’ hot embossing process. In this process, the replication rate of microchannels is high, and microchannels within 5% variance are obtained. This method gives guidance to establish hot embossing process of materials from different source.A substrate with microchannels is bonded with a cover to form close channels. The pretreatment process of PMMA surface before bonding was discussed. The Microfuidic Chips was bonded by thermal bonding method. Its bonding intensity is higher than 0.1 Mpa. The electro-osmotic flow is 2.8x10-4cm-2V-1s-1, and voltage-ampere curves of PMMA microchannel in 20nmol/L buffer solution of borax were tested too. The performance of the PMMA chips is demonstrated in the electrophoretic separation of methamphetamine from byproducts with a precision of 4.4% RSD (n=6) and an efficiency of 11.4x104m-1’. In addition, adhesive bondingmethod was tried out to bond the plastic Microfluidic Chips, and the bonding intensity is higher than that of thermal bonding method.更多还原