金丝键合质量信息研究

【作者】 易容；

【导师】 徐越兰；

【作者基本信息】 南京理工大学 ， 材料加工工程， 2004， 硕士

【摘要】 分析影响键合质量的主要因素，采用均匀试验设计方法设计出的试验方案，分别对18μm、25μm的金丝进行键合试验，测量金丝的抗拉强度，采集焊点图像。 运用 BP 网络技术，建立起一套键合质量预报系统，对金丝键合焊点强度进行模拟和预测。研究结果表明：该模型预测的结果同试验值之间有很好的对应关系，误差控制在10％以内。BP网络用于金丝键合质量的预报具有可行性和有效性。 利用BP网络建立一个质量信息窗口。通过该窗口对工艺参数进行优化，并对优化参数下的焊点进行了可靠性测试。 对于试验采集的焊点图像，运用数字图像处理技术，提取出焊点几何特征。通过研究焊点形态与焊点质量的关系，发现焊点宽度控制在一定范围内，焊点的抗拉强度较高。更多还原

【Abstract】 Analyzing the main influence factors of wire bonding, the experimental projects are designed by homogeneous design. Through bonding experiments of 18 um and25um gold wire, the pull strength of gold wire is measured and the images of bonds areachieved.By using BP network technology, a prediction system of the quality of wire bonding is established. The pull strength of bonds were simulated and predicted with the system. The research shows: There are good correlations between the predicted results and the experimental datum. The error is under 10%. That BP network used for predicting quality of wire bonding is feasible and valid.A window of quality information was established. Processing parameters are optimized through this window, under which the reliability of bond is tested.Using digital image processing technology, the geometrical characters of bond are detected. Through researching the relation of bond’s shape and quality, It is known that the width of bond controlled in a certain range, good pull strength of bond can be achieved.更多还原