在铝硅合金上化学沉积Ni-P、Ni-Cu-P的工艺及性能研究

【作者】 张拥乱；

【导师】 朱有兰；

【作者基本信息】 广东工业大学 ， 材料学， 2004， 硕士

【摘要】 本文研究了在铝硅合金表面化学沉积Ni-P和Ni-Cu-P合金镀层的工艺和性能。通过XRD、SEM、DSC、IM6电化学工作站等手段对两种合金镀层的组织结构、成分和性能进行了研究，并对铝硅合金表面化学沉积镍的机理作了初步的探讨，讨论了铜元素对镀层性能的作用和影响。主要的实验内容和结果包括： (1)本文采用一次浸镍的预处理方法，在铝硅合金表面上化学沉积致密、均匀的Ni-P、Ni-Cu-P合金镀层，采用调节化学沉积Ni-P、Ni-Cu-P合金镀液成分和环境条件对合金镀液的工艺进行了研究，优选出最佳的工艺参数，并研究了各因素对化学沉积Ni-P、Ni-Cu-P合金镀层结构的影响和合金镀层的性能。 (2)利用XRD、SEM、DSC等手段对Ni-P、Ni-Cu-P合金镀层的结构、表面形貌、成分进行了分析。XRD结果表明Ni-P、Ni-Cu-P合金镀层均为非晶态结构，从表面形貌可以看出Ni-Cu-P合金镀层中的铜元素有细化晶粒的作用。DSC分析结果表明，化学沉积Ni-P合金镀层的晶化温度低于化学沉积Ni-Cu-P合金镀层的晶化温度。 (3)采用IM6电化学工作站对化学沉积Ni-P、Ni-Cu-P合金镀层进行耐腐蚀研究，结果表明化学沉积Ni-P合金镀层在酸碱盐中的耐腐蚀电位比化学沉积Ni-Cu-P合金镀层的耐腐蚀电位低，而且化学沉积的Ni-Cu-P合金镀层在酸碱盐中的阳极极化曲线比化学沉积Ni-P合金镀层的阳极极化曲线往正的方向偏移。 (4)利用MVK-H3硬度测试仪测得化学沉积Ni-P、Ni-Cu-P合金镀层随着热处理温度的增高，合金镀层的硬度先增加然后又将低，Ni-Cu-P合金镀层的最大硬度值和Ni-P合金镀层的最大硬度相差不多。 (5)通过采用红点法对化学沉积Ni-P、Ni-Cu-P合金镀层的孔隙率进行测试得出，Ni-P合金镀层的孔隙率比Ni-Cu-P合金镀层的孔隙率低。更多还原

【Abstract】 In this paper, the electrodeposition technology of the Ni-P and Ni-Cu-P alloy coatings on the aluminum and silicon alloy substrate were studied. By means of XRD. SEM, DSC, IM6 electrochemistry workstation etc.. The morphology, structure, content and performances of the Ni-P and Ni-Cu-P alloy coating were analyzed. The deposition mechanism of electroless nickel on aluminum and silicon alloy was discussed tentatively and argued on copper by the action and influence of the coating performance. The main content of the experiments and the results included:(1) By one dip nickel pretreatment, a compact and evengranular Ni-P and Ni-Cu-P alloy coating were deposited on the aluminum and silicon alloy substrate. By changing the content and condition of electroless bath, the technology and coating performance were studied. The optimal electroplating conditions and the influence of technology parameters were acquired.(2) The analysis results of XRD indicated that the Ni-P and Ni-Cu-P alloy coatings were amorphous structure. The surface shape indicated that the copper could diminish the crystal. The DSC results made know that the crystal temperature of the Ni-P alloy coating was lower than the Ni-Cu-P alloy coating’s.(3) The results showed that the erode voltage of the Ni-P alloy coatings was lower than the Ni-Cu-P alloy coatings’ by IM6 electrochemistry station in acid and alkali and salt solutions. At the same time, anodic polarization curves of Ni-Cu-P alloy coatings shifted to the positive direction relative to the Ni-P alloy coatings’ in acid and alkali and salt solutions.(4) By the MVK-H3 hardness instrument, the hardness of the two coatings increased, and then decreased with the heat treatment temperatures. And the maximal hardness of Ni-Cu-P the alloy coating was the same to the Ni-P alloy coating’s.(5) The testing results indicated that the hole rate of the Ni-P alloy coating was lower than the Ni-P alloy coating by hongdian means.更多还原