【作者】 周仲蓉；

【导师】 李志国；

【作者基本信息】 北京工业大学 ， 微电子学与固体电子学， 2004， 硕士

【摘要】 MCM多芯片组件以其体积小，重量轻、性能好等优点而倍受关注，并在电子、医疗、航天、汽车和电信等领域得到了广泛应用。同时，MCM的可靠性问题也成为国际上研究的焦点问题之一。 本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。试验设计制造了5层10层和15层三种低温共烧陶瓷基板样品。基板表面放置了10欧姆10K欧姆和100K欧姆三种厚膜电阻，基板层与层之间通过通孔与金属线（称为导带）连接，试验测试膜电阻及导带电阻值。试验分为两部分，第一部分为极限应力对比试验，第二部分为温度应力与电应力双应力加速试验。极限应力对比试验过程依据GJB548-9方法1010A中温度循环试验条件F要求，样品在-65℃～175℃的条件下做温度循环。加速寿命试验进行了两个温度点的试验，采取的温度点为200℃和230℃，两个不同的电压应力点为16/60V及12/45V（V1/V2）。 本研究采用统计方法先对膜电阻的寿命分布进行分布拟合检验，结果发现可以认为膜电阻的寿命分布服从威布尔分布，然后用最好线性无偏估计算出其分布参数，从而得出平均寿命、特征寿命等参数。利用两个不同的电应力下的寿命得出电应力加速系数，然后算出逆幂率系数。再根据Arrhenius公式，利用两个温度点的数据算出三种不同层数MCM的激活能，从而可以外推出常温下的寿命。 本研究发现，国产低温共烧陶瓷多芯片组件（MCM—C，LTCC基板）中厚膜电阻的寿命分布服从形状参数位m=1.1549的威布尔分布；MCM-C中厚膜电阻电应力的逆幂率系数σ=5.7143；五层、十层和十五层MCM—C的激活能E_Ⅰ、E_Ⅰ及E_Ⅲ为0.192eV、0.165eV和0.114eV；三种层数的MCM—C样品膜电阻寿命数据进行对比Ⅰ₂：Ⅱ₂：Ⅲ₂=432.068：407.088：300.296=1.44：1.36：1。更多还原

【Abstract】 Thanks to its advantages such as small volume, light weight and good performance, Multi-chip Module (MCM) has drawn especial attention and has extensive applications in electronics, medication, spaceflight, automobile and telecommunication. Synchronously the reliability of MCM becomes one of research focuses internationally.This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection. Three types of LTCC (Low-temperature co-fired) substrates with different layers 5, 10 and 15 were designed and made. On top of the substrates locate three kinds of resistors with different resistances 10 ohm, 10K ohm and 100K ohm, and metal lines and vias are used for interconnection between layers. In the whole experiment, resistance of resistors and lines is our testing parameter. The experiment contains two sections, one is comparison experiment under extreme stresses (GEES), and the other is life-accelerated experiment with dual stresses (LAEDS). CEES Follows the method 1010A in GJB548-9, that is, samples are conducted temperature cycling experiment on temperature condition from -65 C to 175 C. While LAEDS conducts experiment under two temperatures 200 C and 230 C, each temperatures with two voltage stresses 16/60V and 12/45 V.With statistical theory this paper first carries out test of goodness of fix on life distribution, with the results that we can accept the hypothesis that the life of thick-film resistors obeys Weibull distribution. Then Best Linear Unbiased Estimation (BLUE) is used to figure out the distributional parameters, thereafter some life parameters such as average life and characteristic life can be available. From the experimental data under two different voltage stresses electric acceleration coefficient is calculated then anti-power law coefficient is figured out. From the experimental data under two different temperatures activation energy is calculated following Arrhenius law, after which life of room temperature can be extrapolated.At last, this study shows the results as follows. Life of thick-film resistors in LTCC substrates made in China obey Weibull distribution with shape parameter m=1.1549; The coefficient of anti-power law of electric stress is a =5.7143; Activation energy EI_ EH and Em of film resistors in 5-layer, 10 layer and 15-layer substrates are 0.192eV, 0.165eV and 0.114eV respectively; The resistor life in the three kinds of substrates has a ratio I2: II3: III2=:432.068: 407.088: 300.296=1.44: 1.36: 1.更多还原