【作者】 陈军艳；

【导师】 阮新波；

【作者基本信息】 南京航空航天大学 ， 电力电子与电力传动， 2004， 硕士

【摘要】 高压直流电源是飞机第三大供电体系。它的二次电源有两种，一种是把270VDC变换为28VDC的直流变换器，另一种是把270VDC变换为115V／400Hz交流电的静止变流器。本文研究DC／DC二次电源的模块化。 本文分析了大功率DC／DC电源模块化的难点，采用一种新型的三维封装结构，完成了一台270VDC输入，28V／36ADC输出的DC／DC模块电源，并对样机进行了测试。样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。尺寸：160×95×23(mm)，重量：小于1kg，满载效率92％。 为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥FC-IPEM(Flip chip-Integrated power electronics module)模块。文章主要对装配工艺进行了探索。更多还原

【Abstract】 The high-voltage dc electric system is the third aviation power supply. There are two kinds of secondary power supply in high-voltage dc electric system, one is DC/DC converter that converts 270VDC to 28VDC, the other is static converter that converts 270VDC to 115VAC/400Hz. The modularity of the second power supply is important to the power system’s performance.The paper analyzes the key issues in the design of a high power modular power supply. A new three-dimensional package structures is introduced, and a prototype of 270VDC input, 28V/36ADC output is built in the lab. Many new technologies, including soft switching technology, Al substrate, SMT, planar transformer and noise suppressors are applied. The size of the prototype is 60x95x23 (mm), and the weight is less than 1kg, and its full-load efficiency is 92%. The assembly process and experimental results are included in this paper.In order to increase the power density of the module, a three-dimensional FC-IPEM package structure is introduced. A half-bridge FC-IPEM module is built in the lab with BGA power devices and flip-chip technique. The assembly process is presented in this paper.更多还原