【作者】 辛三法；

【导师】 靳向煜；

【作者基本信息】 东华大学 ， 纺织材料与纺织品设计， 2004， 硕士

【摘要】 本文重点研制了新型低熔点多元共聚酰胺熔喷非织造材料。研究了低熔点多元共聚酰胺熔喷纺丝成网机理、熔喷工艺及其网膜的粘合性能。针对低熔点多元共聚酰胺的特点建立了熔喷数学模型，分析了影响熔喷实验的各种因素。根据其应用要求，对网膜的热熔粘合机理、压烫条件对剥离强度的影响作了分析。 本研究采用低熔点聚合物是委托上海阿托菲纳高远化工有限公司配制的低熔点多元共聚酰胺原料(样品1和样品2)，其熔点分别为104℃和120℃。首先，对样品进行基本性能的测定，对实验的结果综合分析得出，低熔点多元共聚酰胺适合热熔喷丝成网实验，但是工艺温度对聚合物熔体的性质影响较大。其次，根据本材料的性质对现有的熔喷实验设备系统提出了改进方案，经改进后实验所得的网膜质量有明显提高。 经过研究得出实验参数对网膜性能的影响关系如下： 网膜中纤维的平均直径随着模头温度的升高、随着接收距离的增大、随着空气压力的加大逐渐减小；随着螺杆挤出量加大逐渐增大。纤网面密度CV％值随着接收距离加大、空气压力的增高均呈现先增大而后减小的趋势；随着挤出量的增大逐渐增大。纤网的纵向断裂强度随着挤出量的增加而逐渐增大；随着空气压力的增大，呈现先增大后减小的现象；随着接收距离的增大而逐渐递减。 本研究根据聚合物性质和具体工艺条件，建立了熔喷数学模型，将实验所测得的纤维直径和理论计算进行比较，得出本数学模型对熔喷低熔点多元共聚酰胺纤维直径有较好的预测性。 本文同时对低熔点多元共聚酰胺网膜的粘合机理和对不同摘要面料的粘合性能进行了相关应用研究，得出本网膜热熔胶的最佳压烫工艺条件为:压烫温度140℃、压烫压力1.25kgf/cmZ、压烫时间205。压烫条件对剥离强度的影响关系为:剥离强度随着压烫温度的上升，先增加达到一个峰值后迅速下降;剥离强度随着压烫压力、时间的增加，逐渐增大。 通过对不同材质的粘合面进行粘合实验得出:低熔点多元共聚酞胺网膜热熔胶对纤维素材质的表面粘合良好;对聚酷材质的粘合有选择性，纤维状的粗糙表面粘合较好，而光滑膜状表面粘合较差。因此使用本网膜热熔胶完全可以取代纤维素材质粘合所使用的粘合剂。 本文还对低熔点多元共聚酞胺的热稳定性进行了研究，得出本实验的低熔点多元共聚酞胺适合在高于其熔点50℃的条件下加工，同时对低熔点共聚涤纶的熔喷成网工艺进行了相关探索性的研究。更多还原

【Abstract】 The new nonwovens materials of the low melt-point copolyamide are made and mainly studied in this paper. The meltblown process and technology of low melt point copolyamide and web film thermal bonded property of nonwoven are discussed. The meltblown model of mathematics is made in terms of the characteristic of low melt point copolyamide and many kinds of influence factors of experiment is also analyzed.Considered its application, thermal bonded process and influence factors of press condition to peeling intensity are analyzed.The low melt-point polymer was made by shanghai ATOFINA gaoyuan chemical co.,Ltd. The melt point of sample 1 and 2 is 104℃ and 120℃ ,respectively. First, the basic property of sample was tested, the conclusion was reached by the analysis of the result that the low melt point copolyamide is fit to meltblown experiment regardless of the temperature’s great effect on the characteristic of polymer. Second, the big improvements upon the present meltblown equipment system is made on basis of the characteristic of polymer and it is found that the quality of nonwovens web film made in the later meltblown equipment system increases markedly.After long time’s research, the experiment parameter effects on the characteristic of web film are shown as follow.The mean fiber diameter in the film decreases with increasing of the die temperature, the die to collector distance(DCD) and the attenuating air pressure, and withdecreasing of polymer throughput. The fiberweb density coefficient of mean deviation increases gradually when polymer throughput increases gradually, yet first increases and then decreases when the die to collector distance(DCD) and the attenuating air pressure increase. The fiberweb longitudinal strength increases as the polymer throughput increases and the die to collector distance(DCD) decreases, and first increases and then decreases as the attenuating air pressure increases.The mathematical model is established in terms of polymer performance and specific technical condition. By comparing the theoretical diameter and practical one, the conclusion is reached that the model has good prediction on fiber diameter.The low melt point copolyamide web film thermal bonded process and the adhesivity related to many fabrics are also studied in the paper. The following are the conclusions reached after the experiments and analyzing: the better pressing condition- press temperature 140 癈 , press fore 1.25kgf/cm2, press time 20 s, the peeling strength first rising and then dropping with rising of the press temperature, and the peeling strength rising with rising of the press force and time.The conclusions are reached after thermal bonded experiments to different materials: the low melt point copolyamide web film adhesive has good cohesive action against cellulose fiber material, and has selectivity to polyester material- good cohesive action to fiber coarseness surface but bad action to slippery surface. Hence, the web film adhesive can replace adhesive in the market in cellulose fiber material.Finally, the low melt point copolyamide thermal stability is researched and the conclusion is that the low melt pointcopolyamide is fit to meltblow under the temperature 50℃ above its melt point. Coherence research about meltblown process upon low melt point copolyester is made in the end.更多还原