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多层壳体粘接装置设计与精度控制技术研究

Study on Multilayer Shells Bond Device Design and Precision Control Technology

【作者】 岳晓斌

【导师】 侯力; 李尚政;

【作者基本信息】 四川大学 , 机械工程, 2003, 硕士

【摘要】 多层壳体组件是某产品中的关键零部件,它采用胶粘技术由各层壳体粘接而成。多层壳体组件具有尺寸精度高、形位公差要求严、粘接难度大等特点。现行多层壳体粘接工艺采用手工操作,虽能满足产品加工质量的要求,但存在产品质量不能稳定保证、可靠性较差、固化监控手段落后等缺点。本文对多层壳体零部件的工艺特点及现行粘接工艺进行深入分析,围绕多层壳体粘接装置设计及精度控制技术展开研究,具体内容如下: 首先,简要叙述了粘接的基本原理、粘接工艺的一般过程,重点介绍配胶、涂胶、晾置、固化等工艺过程,分析影响粘接质量的因素及提高粘接质量的控制技术。对曲面多层壳体零部件的特点进行分析,并采用有限元方法分析多层壳体在真空压力作用下的变形情况。详细介绍了多层壳体现行手工粘接的工艺过程,分析粘接过程的特点及手工操作存在的问题。 其次,为提高多层壳体粘接质量,实现固化过程的实时监测,本文根据多层壳体粘接的功能需求,设计了两套粘接装置总体方案。经对比,提出利用T4280双柱坐标镗床作为研制粘接装置的工作平台,进行多层壳体粘接装置的总体设计。分析了粘接装置的结构特点及工作原理,并对组成该装置的支撑承重机构、外层壳体吸具、旋转机构、内层壳体吸具、传感器定位机构等机械机构和测试系统进行设计。 第三,多层壳体粘接计算机监测系统由光栅传感器、光栅数显表、多串口数据采集卡、计算机等组成,介绍了光栅传感器、数显表及数据采集卡的四川大学工程硕士论文摘要相关技术指标。针对多层壳体粘接装置测量与固化过程中的实时监测的技术需求,制定程序流程图,在WindowS 2000环境下用VC十十6.0编制了数据采集、处理程序。计算机数据采集采用异步串行通信方式,在WindowS2000中使用win32 API函数实现对RS232串口的访问,其过程为打开串口、设置串口、数据读写、关闭串口等。数据处理与误差判断采用三点定圆法实现多层壳体粘接时的精确定位,并实现固化过程的实时监测。 最后,以T4280双柱坐标幢床作为整个粘接装置的实验平台,制定了详细的装置安装技术要求、粘接技术规范以及粘接前的各项准备工作细则。设计并加工了多层壳体模拟实验件,进行多层壳体粘接过程的定位、装夹、均匀布胶、位置监测等多种功能的分系统试验及集成演示试验。对实验过程中存在的密封、传感器定位、粘接壳体间位置的校正、数据采集与处理程序及传感器精度稳定性等问题作了详细分析,并提出了相应的改进方案。

【Abstract】 In certain productions, multilayer shells assembly is the key components. Multilayer shells are bonded by stickiness technology. Multiplayer shells assembly have characteristic, which are high dimension precision, strict form and position tolerance, difficult bond technology and etc. At present, the bond technology for multilayer shells is operated by hand, which can be satisfied with production quality request. But there were some disadvantages that are instability production quality, poor reliability and behindhand solidify monitor method. In this dissertation, the present bond technology and the technology feature of multilayer shells are analyzed in particular. The research is deployed about multilayer shells bond device design and precision control technology. The main contents of this dissertation can be described as follows.Firstly, the bond basic principle and the common course of bond technology are briefly recounted. The technology course of preparing adhesives, gelatinize, dry by airing and solidify are particularly introduced. The factors, which influence bond quality, and the control technology’s, which can improve bond quality, are analyzed. The characteristic of multilayer shells assembly is analyzed. At the action of vacuum press, multilayer shells distortion is analyzed with finite element method. Multilayer shells bond technology course, which can be operated by hand, is particularly introduced. The characteristic of bond course, the excellence and disadvantage of handwork operation are analyzed.Secondly, in order to improve multilayer shells bond quality and realize real time monitor in solidify course, two overall bond device projects are designed which based on the bond function requirement of multilayer shells. By contrast, multilayer shells bond device is designed which the T4280 twin columns coordinate boring lathe is used as the bond device labor flat roof. The structure characteristic and working principle are analyzed. The mechanical system, which is made up of support bearing machine, outer-layer shells inspiratory machine, rotary machine, inner-layer shells inspiratory machine, sensor orientation machine and etc, are particularly designed.Thirdly, the test and monitor system of multilayer shells is made up of grating sensors, grating numeral display instruments, multi-serial ports data collect card and computer and etc. The correlative technology of grating sensors, numeral display instruments and data collect card are introduced. Based on the multilayer shells device test and the real time monitor technology request in solidify course, the program flow chart is instituted. The data collect and disposal program are designed with VC++6.0 in Windows2000 environment. Computer data collect use asynchronous serial ports to communicate. The Win32 API functions are used to access RS232 serial ports in Windows2000. Accessing course has open serial ports, setting serial ports, data read and write, close serial ports. Data disposal and tolerance estimation use three points to confirm a circle to realize the accurate orientation for multilayer shells and the real time monitor at solidify course when they are bonded.Lastly, the T4280 twin columns coordinate boring lathe is used as experimentation flat roof for whole bond device. The detailed device installing technology request, bond technology criterion and each preparing work detailed rules before bond are established. The simulation experimentation workpieces of multilayer shell were designed and machined. At multilayer shells bond course, the different system experimentations and integration demo experimentation are operated which are made up of orientation, install and clamp, equality gelatinize, location monitor and etc. In experimentation course, the existent questions areparticularly analyzed which are airproof, sensor orientation, bond location emendation of multilayer shells, data collect and disposal program, sensor reliability and etc. The better projects are brought forward for questions.

  • 【网络出版投稿人】 四川大学
  • 【网络出版年期】2004年 02期
  • 【分类号】TG49
  • 【下载频次】78
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