【作者】 陶汉中；

【导师】 张红；

【作者基本信息】 南京工业大学 ， 化工过程机械， 2003， 硕士

【摘要】 热管是一种高效传热元件，特别适用于小温差高热流密度条件下的散热。随着电子技术的飞速发展，电子元件的热流密度亦愈来愈高，将热管技术应用于大功率电子元器件中的散热，已成为当前一个十分重要的课题。作为典型的大功率电子模块IGBT，具有与其它大功率电子元器件相似的热设计要求，本文针对IGBT，在查阅大量相关文献的基础上，应用理论分析和试验研究相结合的方法，系统地研究了此散热器中的传热核心元件——热虹吸管的性能，并开发研制热管式IGBT散热器。本文的主要研究结果为：（1） 热虹吸管启动性能的研究：通过对从不同充液量、启动前状态、内部汽化核心状态对启动的影响所进行的试验研究，认为大长径比的铜—水热虹吸管管内相变不仅仅为沸腾，而是以蒸发为主，伴有薄液膜的沸腾。本文从理论的角度，定性地分析了受蒸发面积控制的蒸汽生成量对热虹吸管启动性能的影响。通过管壁上某一特征热电偶的温度变化过程，分析说明了热虹吸管在启动整个过程内部的蒸汽压、蒸汽流量、相变面积以及蒸汽生成量的一些半定量的关系；（2） 最佳充液量的研究：热虹吸管的传热性能与其充液量有着密切的关系，本文采用理论分析与试验研究相结合方法，对热虹吸管内部的充液量进行研究，给出了较为简单且可靠的计算方法；（3） 热虹吸管在倾斜状态下的传热性能：本文讨论了热虹吸管在倾斜状态下的传热机理及性能，研究了正常工作情况下倾斜热虹吸管的传热性能，为热虹吸管在电子模块散热器中的进一步应用奠定了基础；（4） 开发研制了热管式IGBT散热器：经过理论分析、模拟计算和试验验证，证明所开发的热管式IGBT散热器完全能满足设计要求，并且进一步分析了接触热阻是影响散热器性能的关键因素之一。各项研究结果表明：热管式散热器是完全可以满足散热要求的，是解决大功率电子模块散热的有效途径。这些结果不但拓展了大功率电子模块散热器的方式，也为热管式大功率电子模块散热器走向市场奠定了基础。更多还原

【Abstract】 As we know, heat pipe is a high efficient component of heat transfer which is especially applicable to the situation of high heat flux. With the rapid development of electronic technology, it becomes an important topic to apply heat pipe technology to high power electronic devices.As a typical power electronic module, IGBT has the same thermo design request as other high power electronic devices. Based on consulting a number of references, the performance of thermosyphon, which is the key component of heat pipe heat sink for IGBT, is studied, and the heat pipe heat sink for IGBT is developed and researched with the approach of combining the theoretic analysis and the experiment study. The main results in this paper are as follows:(1) Study on starting up performance of thermosyphon: According to the study on the states before and after starting up of thermosyphon with the various filling amount, it is considered that the phase change heat transfer inside the copper-water thermosyphon with a large ratio of length and diameter is not only influenced by the boiling degree of superheat, but also controlled by evaporation and companied with the boiling of the thin liquid film. The influence of the vapor amount from the controlled evaporation area to the performance of the thermosyphon is studied theoretically. The semi-quantitative correlation of vapor pressure, vapor flow amount, area of phase change and vapor amount inside the thermosyphon during the whole process of starting up is described by means of the temperature change of a thermocouple installed on the pipe wall. (2) Study on the optimal filling amount: The performance of thermosyphon is greatly affected by the filling amount. The work fluid filling amount in the thermosyphon is studied, and the more simple and reliable approach of calculating optimal filling amount is presented by means of combining the theoretic analysis and the experimental study. (3) Study on the performance of the inclined thermosyphon: The mechanism and performance of heat transfer inside the inclined thermosyphon, and heat transfer performance of the inclined thermosyphon in operating situation are discussed. The foundation of applying thermosyphon to heat sink for the electronic module is built.(4) Development of the IGBT heat pipe heat sink: It is found that the heat pipe heat sink for IGBT can completely meet the design requests through the theoretic analysis, simulating calculation and experimental verification. Then, the one of key factors of improving the performance of heat sink is the contact thermal resistance. All of research results indicated that heat pipe heat sink for IGBT can completely meet the thermodispersion request which is an effective method to solve the cooling of the power electronic module. These results not only develop the way of applying heat sink for power electronic module, but also establish the base of commercialization of heat pipe heat sink for power electronic module.更多还原