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形状记忆合金相变点测试系统研究

Study on Transformation Temperature Testing System for Shape Memory Alloys

【作者】 甄睿

【导师】 周汉义;

【作者基本信息】 合肥工业大学 , 材料学, 2003, 硕士

【摘要】 本文主要论述了MSP430单片机在形状记忆合金相变点测试中的应用,实现了一个以MSP430F149为核心的形状记忆合金相变点测试系统的研制。 首先介绍了形状记忆效应基本原理及形状记忆合金相变点常用的测量方法,提出应用单片机技术从硬件和软件两方面着手解决电阻法测量时常出现的问题。介绍了单片机应用系统的设计原则和MSP430芯片的发展、特点以及在各个领域中的广泛应用,并说明了选择TI公司MSP430F149作为本系统的核心微处理器芯片。 接着详细介绍了研制过程中本系统硬件电路的设计、软件所完成的功能和各模块的流程设计、系统的软硬件抗干扰设计以及印刷电路板的设计等。 最后叙述了在软硬件调试系统过程中遇到的问题和解决的办法,给出几种测量方法的测量结果加以对比及验证,并展望了该仪器的应用前景及可以进一步完善的地方。

【Abstract】 This paper discusses about the application of MSP430 in the transformation temperature testing system for shape memory alloys and the development of the transformation temperature testing system for shape memory alloys with MSP430F149.Firstly, it introduces the principle of shape memory effect and the methods of testing shape memory alloys’ transformation temperature which we always used, brings up that using micro-controller technology to solve the problems that appears in electrical resistance measurements. And it also introduces the contrivable principle of the application system of micro-controller and the development and characters of MSP430, widespread applications on all area, and explicates that we choose MSP430F149, which is made by TI company, as the core chip of the instrument.Secondly, it introduces the development of this system in detail. It includes the designs of hardware, software, resisting interference and making the module.Lastly, it describes the difficulties met in debugging and ways to solve the problems. Some typical measurements and results have been also given to compare and contrast. Moreover, it looks in the future of this instrument and brings up the parts to be improved in this system.

  • 【分类号】TG139.6
  • 【被引频次】1
  • 【下载频次】236
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