【作者】 赵安林；

【导师】 童明伟；

【作者基本信息】 重庆大学 ， 制冷及低温工程， 2002， 硕士

【摘要】 随着随着超大规模集成电路(VLSI)和高速大型电子计算机的发展，集成电路和计算机内的热流密度很快地增加。CPU从较早期的Intel 386SL、Intel 486SL、Intel DX2、Intel DX4发展到Pentium时代，速度越来越快。特别是PentiumⅣ中央处理器的推出，CPU的发展迈进了一个崭新的时代。处理速度达到G数量级，功率消耗更达几十瓦。如何解决CPU散热问题，成为关注的焦点。 本实验首次研究了绿色环保工质R600a在一种铝质重力热管中的工作特性。对其充灌量、散热量、电子元件(CPU模拟芯片)表面与环境温度之差及通风、流速的影响进行了系统的测试，发现充液量与温差的关系在负荷不变时呈抛物线分布，其极小值点对应的充液量是最佳充液量G。在充液量为G时，对风速V、散热量Q进行的研究表明，当风速超过1.5m/s后，奔腾Ⅳ芯片在60w发热条件下芯片温度小于40℃，能满足长期正常工作。另外，本文还采用了不同的方法计算了CPU重力热管液阻极限。更多还原

【Abstract】 With the developments of very large scale integration (VLSI) and high-speed large computers,the specific rate of heat flow increases rapidly. As the performance and power of each generation have increased,CPU developed from 386SL and 486SL,to DX2,to DX4. Especially the detrusion of Pentium IV,CPU strides forward to a spick-and-span times .And the power dissipation of CPU is higher than ever before and the process speed of CPU reaches as fast as billion. Thus maintaining CPU surface temperature at acceptable levels has been a challenging task in the realm of heat dissipation.This experiment focuses on the characteristic of green refrigerant R600a in a small parallel flow aluminum closed two-phase thermosiphon and measures all the quantity of injected mass and heat dissipation,the speed of air and the difference of temperature of the electronic element (CPU simulate chip) surface and environment. It shows that the injection quantity and the difference of temperature distribute as a parabola which is at the same load,and the minimum of the parabola corresponds to the optimum quantity of injection(G).Under the condition that the quantity of injected mass,the air speed and the heat quantity is respectively G,V and Q,the research demonstrates that the Pentium IV chip’s temperature variation can be controlled under 40C and work normally when the wind speed overpass 1.5m/s and the power dissipation of the chip is 60w.Otherwise this paper calculates the flooding limit of thermosiphon with several different methods.更多还原