CBGA热力耦合失效的实验研究和有限元分析

【作者】 杨玉平；

【导师】 王卫宁；

【作者基本信息】 首都师范大学 ， 光学， 2002， 硕士

【摘要】 本文首先简要地介绍了微电子封装技术及其可靠性研究的现状和进展，之后对CBGA／PCB组件的热力耦合失效进行了实验研究和有限元模拟。 本文在系统介绍云纹干涉和全息干涉的同时，通过设计一套联合光路，建立实验过程和数据自动和半自动化处理系统。既节省时间，又提高了精度。通过实验测试，得出了室温环境、高温环境和低温环境下组件表观变形的特点和规律。 在实验条件的基础上，又利用有限元软件ANSYS5.3，通过2-D PLANE42和3-D SOLID模型分别计算了CBGA、PCB和焊球的变形、应变、应力场分布，得出了最大应力的位置和数值。 本文通过实验测试和有限元模拟，实现了对CBGA／PCB组件热力耦合失效的全面分析，对微电子组件的设计提供了可靠的数据，有重要的参考价值。更多还原

【Abstract】 Above all, the electronic packages and the current research state on its reliability were briefly introduced in this dissertation. Then, the thermal and mechanical failures of the solder joints in the EGA were researched by the experimental method and Finite Element Method (FEM).In this paper, the theory of the Moire Interferometry (MI) and Holographic Interferometry (HI) was systemically explained. Here, an integrative light path was put forward to full use of both methods, and a system was set up to deal with the experiment and its data automatically or half-automatically, which not only can save time but also has higher accuracy. By the experiments, we obtained the trait and regulation of specimen’s deformation in room, high and low temperature environment.Based on data of experiments, the ANSYS5.3 software was used to simulate and compute the deformations of CBGA/PCB by 2-D PLANE42 model and 3-D SOLID model. By finite element simulation, the stresses and strains on the CBGA, PCB and solder joints were obtained, and the location and the value of the most stress were known.By the experiments and finite element simulation, the thermal and mechanical reliabilities of the solder joints in the BGA were fully analyzed in this paper. It provided credible dada for the design of the electronic packages, which was significant.更多还原