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用不同配比度的预烧粉末和陶瓷靶在Ag、Au、Pt底电极上溅射制取PZT铁电薄膜的研究

Study on PZT Ferroelectric Thin Films Prepared by Sputtering Powder and Ceramic targets with various Zr:Ti Ratios Deposited on Ag、Au、Pt Electrodes

【作者】 周慎平

【导师】 叶勤;

【作者基本信息】 暨南大学 , 凝聚态物理, 2000, 硕士

【摘要】 锆钛酸铅(PZT)是一种优良的铁电材料,具有耦合系数和压电系数大、居里点高及可通过变更配比度和掺杂在很大范围内调整性能以满足多种不同需要等优点。把PZT制成薄膜状,并保持其优良的电学特性,能大大缩小器件的体积,提高器件的性能;此外,还能利用二维材料的特有性能,使PZT在传感器等多方面的应用获得更广阔的前景。 本文以降低PZT薄膜退火温度,提高电学特性为目的,研究了RF溅射法制取PZT铁电薄膜的制备工艺和电学特性。改进了靶材的制备工艺。比较了Au、Ag、Pt三种底电极上PZT薄膜晶化成钙钛矿结构的退火温度和电学特性。对比了锆钛配比度为30/70、53/47、70/30的PZT铁电薄膜各方面不同的特点。比较了用预烧粉末、块状陶瓷作为靶在PZT铁电薄膜的制备中的不同情况。与此同时,研究了真空蒸镀法制备Ag、Au、Pt三种底电极的制备工艺。 研究结果发现:用冷压、不加粘合剂成型的办法可以制备合格的PZT块状靶材;用真空蒸镀法可以制取蒸发温度很高的Pt底电极,尽管薄膜淀积速率较低;当Ag膜达到一定厚度时,可以解决Ag膜退火后球化带来的电极作用失效的问题;相对于Au、Pt而言,Ag电极能有效降低PZT薄膜的晶化温度100-200℃,Pt底电极能使PZT薄膜的电学性能达到最佳;配比度为30/70的情况下,薄膜的淀积速率最大,完全晶化成钙钛矿结构所需的退火温度最低。与块状靶相比,用预烧粉末靶制取的薄膜能有效地降低晶化温度达200℃,但对于预烧粉末靶,薄膜的淀积速率较低。

【Abstract】 Pb(Zr,Ti)Os (PZT) is a kind of ferroelectric materials, whicheXhibits high value of dielectfic constant, spofltaneous polariZtion ps,moduli dij of piezoelectricity and electromechanical couPlingcoefficient .If the electric properties of PZT ferroelectric can be keptWhen PZT is made in the form of thin film,we can downsize theelectronic components and PZT thin films will be used extensively inmany aPplications (e.g. actuators, sensors ).This paPer investigates the fabricating process and electricproperties of PZT thin films deposited by r. f sputtering for the purposeof decreasing the annealing temperature and improving the electricproperties. The whole work includes f improving fabricating technique oftarget; investigating different annealing temperature and electficproperties of PZT thin film on the condition that the films are depositedon the three kinds of electrode (incIuding Ag, Au, Pt) and on thecondition that the Zr:Ti concefltration ratios aredifferent(30f70,53 f47,70f30) and on the condition thdt the ceramics targetis changed into powder target, investigating fabricating technique ofbottom electrodes (including Ag, An, Pt) formed by evaPoraton.The result indicates f PZT target can be fabricated not using themethod of hot-press and not adding bond, Pt electrode can be made byevaporation, the annealing temperature of PZT thin film on Ag electrodeis lower than on Au and on Pt electrode, when the Zr;Ti concefltfationratio is 30f70, the crystal temperature is the lowest, PZT thin film madeby powder target can decrease the annealing temPerthee effectively.

  • 【网络出版投稿人】 暨南大学
  • 【网络出版年期】2002年 01期
  • 【分类号】O484.1;TM221
  • 【下载频次】229
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