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超低温压力传感器的结构设计

The Design of Ultra-low Temperature Pressure Sensor Structure

【作者】 季长红

【导师】 张斌珍;

【作者基本信息】 中北大学 , 微电子学与固体电子学, 2012, 硕士

【摘要】 超低温压力传感器是指在4K~110K范围内的低温环境下能正常工作的压力传感器。在众多类型的压力传感器中,超低温压力传感器因其特殊应用环境而日渐受到人们的重视,尤其是在液氢液氧作为燃料使用越来越多的情况下。超低温压力传感器在航天、工业运输等领域得到应用。论文介绍了国内外各种超低温压力传感器的研究现状。系统论述超低温压力传感器的工作原理并进行结构设计。本文还创新性的采用多晶硅纳米薄膜作为敏感电阻并应用于超低温环境下,开拓了多晶硅薄膜的又一应用方向。设计的传感器制作工艺简单,与集成电路工艺兼容,制作成本低。论文利用有限元分析法,借助了ANSYS软件,建模分析了传感器的弹性承压膜的应力场分布情况,确定了多晶硅压敏电阻的位置及其排列方式。然后在理论分析的基础上,介绍了每个传感器参数的设计过程,对这一传感器的弹性膜尺寸、压敏电阻和版图进行了设计。在研究加工工艺的基础上,根据设计的结构绘制了传感器加工用的版图,并设计了传感器的加工工艺,在文中给出了加工的详细工艺步骤。除此之外,本文也对传感器的封装结构进行设计并对封装工艺进行了初步研究。

【Abstract】 Ultra-low temperature pressure sensor is a pressure sensor which works in lowtemperature environment within the range of4K~110K. In many types of pressure sensors,because of their special application environment, people are growing to pay more attention inthe ultra-low temperature pressure sensors, especially in the case of more and more liquidhydrogen and liquid oxygen used as fuel. The ultra-low temperature pressure sensors are usedin the fields of aerospace, industrial and transportation.This paper introduces the research status of ultra-low temperature pressure sensor at homeand abroad. We discuss the working principle and design the structure of the ultra-lowtemperature pressure sensors. The article also innovative use polysilicon nanofilm as sensitiveresistor and used it in the ultra-low temperature environment, opened up another applicationdirection of the polysilicon film. The production process of the sensor designed in our paper issimple and compatible with IC technology, and need low production costs.In this paper, using the finite element analysis ANSYS software, modeling and analysisingof stress field distribution of the elastic pressure membrane, determine the location andarrangement of the polycrystalline silicon pressure-sensitive resistor. On the basis oftheoretical analysis, introduce the design process of each sensor parameters, including elasticmembrane dimensions, varistor and layout design.On the basis of the research process, we draw the layout of the sensor processingaccording to the design of the structure, and design the process of the sensor and present thedetailed process steps of the processing. In addition, the package structure design of the sensorand packaging technology conduct a preliminary study.

  • 【网络出版投稿人】 中北大学
  • 【网络出版年期】2012年 11期
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