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0.18微米高压器件生产周期改善与工艺优化研究
【作者】 嵇刚;
【作者基本信息】 复旦大学 , 集成电路, 2011, 硕士
【摘要】 半导体晶圆生产线是世界上公认的最为复杂的生产线之一,产品更新换代快,市场竞争激烈,设备繁多且昂贵。只有使产品做到又好又快的交付,才能赢得客户。当今如何提升自身生产能力以满足客户日益苛刻的需求,将是晶圆芯片代工厂必须解决的问题。本文以基于客户需求的生产周期研究为核心,将代工厂各种生产指标管理结合在一起,摸索出一个整体解决方案,系统地提升了日常生产效率并改善了生产周期。同时本文结合0.18微米高压器件产品工艺流程的优化,将生产和工艺有效的结合起来,为业界提供一套完整的高水平生产周期管理参考方案。
【Abstract】 The semiconductor foundry is the mostly complicated operation system in the word. If we delivery high quality products on time, we can gain credit from the customers. However, it is a big problem that how to improve production capability to meet customer’s rigorous requirements. This thesis is aimed to study the cycle time based on the customers’ requirements, and find solutions to improve daily operation efficiency and reduce cycle time. Together with the optimization of 0.18 micron high voltage process, the thesis also provides an example in which it shows how to improve the management of cycle time.
【Key words】 Cycle Time; Dispatch rule; Hard bake; Equipment efficiency; Equipment capacity; Semiconductor manufacturing;
- 【网络出版投稿人】 复旦大学 【网络出版年期】2012年 08期
- 【分类号】TN305
- 【下载频次】31