【作者】 金涛；

【导师】 熊有伦； 黄永安；

【作者基本信息】 华中科技大学 ， 机械电子工程， 2011， 硕士

【摘要】 目前RFID(射频识别)的应用领域越来越广,标签需求量也越来越大,因此RFID标签封装设备的研制有着极其重大的科研意义。Strap封装作为RFID标签封装的一种方式,其封装效率远大于传统封装,可有效降低封装成本,代表着未来RFID标签制作的一个趋势。故本文设计了基于各向异性导电胶封装工艺的Strap标签封装设备热压模块,着重对热压模块关键部件热压头进行方案设计并验证,最终实现了整个热压模块的机构设计。首先,根据整台封装设备的设计指标,对热压模块提出设计要求,根据Strap基板上的天线焊盘排布方式,对热压固化过程作出时序规划,并对热压模块关键部件热压头提出设计指标,最终按照设备功能要求提出热压模块初方案。其次,依据设计指标与实际工况需求对热压头控制方案进行设计,包括温度控制方案与压力控制方案。根据该温控系统设计指标对关键零部件选型,获得一种最优配置,并对设计的温控系统进行实验验证以确定其控制效果。对压力控制方案的设计提出两种设计方案,并对气缸压力控制方案进行实验验证,通过分析比较后最终选定采用气缸压力控制方案。然后根据设计需求建立热压头结构初模型,进行有限元分析,依据分析结果对热压头结构进行优化设计,最终确定热压头部件结构。为验证有限元分析结果正确性对成品热压头部件进行温度均衡性、隔热性实验验证,并通过实际封装实验验证热压头部件对芯片的封装效果,该效果已达到本文所提出的设计要求。最后依据热压模块的运动规划和热压头的确定参数,对整个热压模块进行传动方案设计和关键部件机构设计,最终完成整个热压模块的机构设计。更多还原

【Abstract】 At present the application of the radio frequency identification technology is used widely, and the demand of RFID tags is growing rapidly, therefore, it is very significant to do the research and development of RFID tag-package equipments. As an especial package-way of RFID, Strap-package has many advantages and represents a development tendency. This paper mainly states how to design the hot-pressing module of Strap-package equipment which is based on ACA packaging technology, focusing on design of the hot-pressing bonder which is the key components of hot-pressing module.Firstly, the design requirement of hot-pressing module is created according to the design figure of the equipment, and the time and route of hot-pressing module are planned according to antenna distribution of Strap substrate. Then an initial plan of hot-pressing module is created.Secondly, the control scheme of the hot-pressing bonder is designed according to the requirement of thermal and pressure precise control, and they are verified through the experiment.Thirdly, the finite element model of the thermo-compression bonder is created, and the structure of hot-pressing bonder is optimized according to the analysis result. An excellent hot-pressing bonder is created after a series of improvements. The results of the finite element analysis are verified by the thermal experiment. Through the actual package experiment, the designed bonder has reached the design requirements which are proposed in this paper.Finally, hot-pressing module is designed according to the design requirement, and the autochart of hot-pressing process is achieved.更多还原