【作者】 张国辉；

【导师】 刘凤岐；

【作者基本信息】 吉林大学 ， 高分子化学与物理， 2011， 硕士

【摘要】 环氧树脂胶黏剂间世已有60余年,并以其产品的多样化、卓越的性能、广泛的应用,使其应用在航空航天、军工汽车、石油化工、建筑建材、电子电器等日常生活和高新技术的领域。人们一直致力于改性环氧树脂的研究工作,并且在前人研究的基础上不断的进步,开发设计出更多新的环氧树脂胶黏剂。随着科技的进步,为了满足极端苛刻的使用要求,近几年的的改性方向主要是在添加剂上,如固化剂、稀释剂、增韧剂、增塑剂、促进剂等。对于探寻新的改性环氧树脂胶黏剂方法的步伐从未停止过。本文主要是在固化剂和稀释剂改性环氧树脂胶黏剂两个方面进行了一些探索。固化剂方面合成了低分子聚酰胺,并与环氧树脂E-44混合固化,对其固化体系的力学性能和热性能分析讨论；稀释剂方面改进了合成间苯二酚二缩水甘油醚的方法,使其生产成本降低,并研究了其与环氧树脂E-44共混体系的性能与组成的关系。更多还原

【Abstract】 Comparing with other thermosetting resin, epoxy resin possesses its unique excellent performance, because it consists of such polar groups and active groups as epoxy base, hydroxyl, ether. Epoxy adhesive which can meet many practical applications, offering distinctive performances, whereas other kinds of thermosetting resin have not represented yet, can be prepared by blending epoxy resin with epoxy resin curing agent, promoting agents, modifier and additives. To satisfy the requirement of application for different fields, the focus of researchers worldwide on the modification of epoxy resin curing agent is strengthened recently, resulting in numerously valuable experiences. Moreover, investigation of the influence of different modification materials and conditions on the modified products and exploitation of new modification methods or the synthesis of new epoxy curing agent are still intriguing to scientists dedicated to epoxy adhesive. This thesis mainly investigates the mechanical properties and thermodynamic properties of epoxy adhesive using polyamide as curing agent or modified with epoxy thinners, which contribute considerably to designing formula and show great potential for industrial application.In the first part, polyamide class curing agents with relatively low molecular weight was synthesized by tuning the ratio of acid with respect to amine, followed by molecular structure characterization and essential tests about their physical properties. Then the well prepared polyamide was mixed with epoxy resin according to different weight ratio, and afterwards the effect of curing process on thermal properties mechanical properties was investigated. The results indicated that the curing rate under room temperature is relatively slow, costing about 7 days, while the curing process can be completed totally within 4h at 120℃. Moreover, the tensile strength of epoxy resin cured at 120℃could reach lOMPa, which is proved much higher than that cured at room temperature. Noticeably, the value of Tg of epoxy resin which had undergone curing process is higher than that without any treatment and polyamide itself, and increased with an increase in polyamide content relative to epoxy resin,In the second part, epoxy adhesive was modified with glycidyl ether class epoxy thinner in which synthetic process condition of RDGE was improved. Influence of reaction condition on product was investigated via the orthogonal experiment and single factor analysis method. Finally, E-44 was sequentially blended with RDGE described before. The relationship, between the viscosities of the hybrid system and composition or temperature, was investigated respectively. Most importantly, mechanical properties of all the blends were tested thoroughly here.更多还原