【作者】 孟威；

【导师】 张建卓；

【作者基本信息】 辽宁工程技术大学 ， 机械设计及理论， 2009， 硕士

【摘要】 磁性器件的集成是推进电子系统小型化的重要途径之一,同时有效的磁集成技术可以降低磁性器件的损耗,提高电子系统整机效率。将薄膜制备技术、MEMS工艺技术和磁集成技术结合在一起制备集成磁件是磁性器件未来发展的必由之路。本文深入系统地研究了基于交错并联Buck变换器的薄膜阵列式集成磁件结构方案,并利用有限元分析软件进行了优化分析,为低损耗集成磁件的设计提供了技术支持;研究了采用真空磁控溅射技术制备的FeCuNbSiB和FeCoV磁性薄膜样品,制备的薄膜样品采用X射线衍射仪(XRD)观察了晶体结构,用场发射扫描电子显微镜(FE-SEM)观察沉积后的薄膜的断面结构和表面形态,采用X射线能量色散谱(EDX)分析样品的成份,采用VSM测试样品的静态磁性能,测试结果表明FeCuNbSiB薄膜的各项指标要优于FeCoV薄膜;利用MEMS技术和磁控溅射技术制备了FeCuNbSiB薄膜的一种阵列式集成磁件,给出了制备工艺流程,为其他方案的磁性器件制备提供了技术支持。更多还原

【Abstract】 Magnetic integration is one important way to advance miniaturization of electronic systems, while the effective integration of magnetic can reduce the magnetic loss and improve the efficiency of electronic system machine. Combination of the thin film technology, MEMS process technology and magnetic integrated technology to produce an integrated magnetic, which is the only way for the future development of magnetic devices. This paper study the program of the Buck converter based on staggered parallel array of thin film integrated magnetic structure, and to use finite element analysis software to optimize the analysis, which provide technical support to the design of low-loss integrated magnetic; research the samples of magnetic thin film FeCuNbSiB and FeCoV created by vacuum magnetron sputtering. The crystal structure of samples was observed by using X-ray diffraction (XRD), Observation of deposited films after the cross-section structure and surface morphology by field emission scanning electron microscopy (FE-SEM), analysis of the sample composition by X-ray energy dispersive spectroscopy (EDX), using VSM test the static magnetic properties of sample. Test results show that the indicators of FeCuNbSiB film is superior to FeCoV film; using MEMS technology and magnetron sputtering technology to produce a kind of Array Integrated Magnetics, which constituted by the FeCuNbSiB. And give manufacturing process. And provide technical support to other programs of magnetic devices manufacturing.更多还原