【摘要】 采用放电等离子烧结技术成功制备具有高热学和力学性能的50vol.%SiC_p/Al复合材料,研究烧结温度对复合材料热导率、热膨胀系数和抗弯强度的影响。结果表明,在520℃下烧结获得的复合材料,导热系数为189W/（m·K）,热膨胀系数（50～200℃）为10.03×10^-6K^-1,抗弯强度为649 MPa。Al合金基体与SiC颗粒之间的界面结合良好,复合材料接近完全致密,因而具有较高的热学性能和力学性能。为满足高性能电子封装材料的制备提供一种新的可行方法。更多还原

【Abstract】 50 vol.% SiC_p/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiC_p/Al composites were carefully investigated. The results show that the SiC_p/Al composites sintered at 520 ℃ exhibits a thermal conductivity of 189 W/（m·K）, a coefficient of thermal expansion（50-200 ℃） of 10.03×10^-6 K^-1 and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.更多还原