【摘要】 采用新型固体摩擦滑移材料二硫化钼作为涂层材料,利用实体软钢棒作为限位消能装置,提出了一种应用于框架结构既能消能又能隔震的新型分离式摩擦滑移隔震系统,探讨了其相应的设计和应用方法。采用MTS电液伺服试验系统,对文中研发的新型摩擦滑移隔震装置进行了摩擦系数测定试验,测试了摩擦滑移隔震装置的静和动力摩擦系数,建立了相应的摩擦滑移恢复力模型。采用SAP2000有限元分析软件,分析了某框架结构在抗震时和滑移隔震时的地震反应规律,从结构的加速度反应和层间位移反应、层间剪力反应等方面分析了隔震结构的减震效果。结果表明,新型摩擦滑移隔震装置的减震效果比较明显。一般情况下当场地类别为Ⅱ类,抗震设防烈度为8度时,利用新型滑移隔震结构的加速度反应可降低50%左右,层间位移反应减小明显,层间剪力反应可降低50%左右。另外,只要确定合理的构造以及实施方案,这种装置能够满足框架结构的隔震减震要求,可应用于实际工程结构。更多还原

【Abstract】 Using the new type solid friction slip material molybdenum disulfide as coating material and the entity mild steel bar as limit and energy dissipation device,one new type of separation friction- sliding isolation system that not only has energy dissipation property but also isolation was put forward for applying in frame structures,and the design and application methods were discussed. With the MTS electro- hydraulic servo test system,the slip performance test of the new friction- sliding isolation device was done,the static and dynamic friction coefficients of the friction- sliding isolation device were tested,and the corresponding friction slip restoring force model was established. Using the finite element analysis software SAP2000,the seismic response laws of a frame structure was analyzed with or without sliding isolation,the damping effect of the isolation structure were analyzed from the acceleration response,layer displacement reaction and interlayer shear response. The results show that the new friction- sliding isolation device shock absorption effect was quite obvious,usually under the conditions that the site classification ofⅡ and the seismic fortification intensity of 8 degrees,the acceleration response could be reduced by 50% or so with using the new sliding isolation device,the layer displacement reaction decreased obviously,and the interlayer shear reaction can be reduced by 50% or so. In addition,as long as the construction and the implementation scheme are reasonable,the device can meet the shock isolation requirements of the frame structure and be applied in practical engineering.更多还原