【摘要】 合成了一种新型树枝状聚合物TE-6CSSNa,并对比氢氧化钠(NaOH)和二甲基二硫代氨基甲酸钠(SDD),重点考察pH和投加量对实际电镀废水中Cu和Ni去除效果的影响。结果表明,pH和投加量都对重金属的去除有较大影响。随着pH或投加量的增加,Cu和Ni残留浓度呈现先降低后升高的趋势。废水中ρ(Cu)=6.82 mg/L、ρ(Ni)=64.36 mg/L,单独使用NaOH或SDD时,出水都无法达到《电镀污染物排放标准》(GB 21900-2008)表3中Cu和Ni特别排放限值要求(Cu<0.3 mg/L,Ni<0.1 mg/L),而采用TE-6CSSNa处理废水,在pH=8.6、投加量为275 mg/L、反应5 min、静置30 min时,残留Ni浓度远低于表3的排放限值,残留Cu浓度甚至低于检出限,说明TE-6CSSNa处理效果明显优于NaOH和SDD,具有重大的实用意义。更多还原

【Abstract】 In this research, a new type of dendrimer(TE-6 CSSNa) was synthesized. Compared with sodium hydroxide(NaOH) and dimethyldithiocarbamic acid sodium salt(SDD), the effects of pH and dosage of agents on removal of Cu and Ni in electroplating wastewater were investigated. Results showed that the initial pH and dosage strongly influenced the removal of Cu and Ni. With increase of pH or dosage, the residual Cu and Ni concentrations decreased first and then increased. Using NaOH or SDD separately as treatment agent, the effluent can not meet Cu and Ni special emission limit of 《Emission standard of pollutants for electroplating》(GB21900-2008) when the initial concentrations of Cu and Ni were 6.82 mg/L and 64.36 mg/L. Whereas treated wastewater could reach and even far below the standard values when using TE-6 CSSNa to treatment the wastewater, under the conditions of dosage 275 mg/L, pH 8.6, reaction time 5 min and leave it for 30 minutes. The removal efficiency of TE-6 CSSNa was obviously better than NaOH and SDD, which suggested that TE-6 CSSNa has potential ability for heavy metals removal from wastewater.更多还原