【摘要】 填充型高导热聚合物复合材料是目前解决电子器件散热问题的重要材料。基于此,该文通过液相剥离和化学还原法制备了氮化硼纳米片/银纳米粒子(BNNSs/AgNPs)杂化粒子,并以此为填料制备了BNNSs/AgNPs/环氧树脂复合材料。前期研究工作证实通过BNNSs/AgNPs杂化粒子的填充,复合材料的导热性能得到了有效提高。然而,复合材料其他方面的综合性能也相当重要。因此,通过热失重、动态热机械性能以及介电性能测试对BNNSs/AgNPs/环氧树脂复合体系的电学和力学性能进行考察和分析。结果表明,杂化粒子的填充对复合材料热分解温度有所提高,复合物的介电常数随着填料含量的增加而增加,BNNSs/AgNPs/环氧树脂的介电常数相对于BNNSs/环氧树脂有进一步的提高。复合材料的储能模量和玻璃化转变温度随着填料含量的增加而升高。相对于BNNSs,BNNSs/AgNPs杂化粒子使得环氧树脂复合物的玻璃化转变温度进一步提高。BNNSs/AgNPs/环氧树脂复合材料良好的热学、力学和电学性能,能进一步满足聚合物基复合材料在现代电子器件和设备封装领域的要求。更多还原

【Abstract】 Filled high thermally conductive polymer composites will be vital materials to resolve heat dissipation problem in electronics. Herein, boron nitride nanosheet/silver nanoparticles(BNNSs/AgNPs) hybrids were prepared through liquid exfoliation and chemical reduction method, and then were added into epoxy resin(EP) to prepare BNNSs/AgNPs/EP composites. Previous study has proved that the thermal conductivities of the composites were enhanced with the addition of the BNNSs/AgNPs hybrids. Further, the over-all properties are also important to evaluate the performance of the polymer composites. In this paper, electrical and mechanical properties of the BNNSs/AgNPs/EP composites were investigated by thermogravimetric analysis, dynamic thermomechanical analysis and dielectric strength measurement. The result shows that the decomposed temperature is increased with the addition of BNNSs/AgNPs hybrids, the dielectric constant is increased with the increase of the filler content, and the dielectric constant of BNNSs/AgNPs/EP is higher than that of BNNSs/EP. Energy storage modulus and glass transition temperature are both increased with increasing the filler content. Compared with BNNSs, impregnation of BNNSs/AgNPs hybrids to the EP makes the composite with higher glass transition temperature. The results indicate that the obtained BNNSs/AgNPs/EP composites, possessing good thermal, electrical and mechanical properties, will meet the requirement in modern electronics packaging field.更多还原