【作者】 沈小虎；

【导师】 王德苗； 金浩；

【作者基本信息】 浙江大学 ， 物理电子学， 2013， 博士

【摘要】 随着信息通信产业的快速发展,电子元器件呈现微型化、环保绿色的发展趋势。铁氧体片式电感作为难以集成化的电子元件,其表面金属化工艺过去一直采用着手工涂刷—高温烧结银浆—电镀的落后工艺,不仅效率低下,生产成本高,生产过程存在严重污染,而且其金属化电极层也难以经受无铅焊料的高温熔蚀。本文从理论到生产实践,系统地研究了铁氧体陶瓷表面金属化技术,并进行了产业化的研究,成功实现了铁氧体磁芯磁控溅射金属化的产业化生产。论文的主要研究成果如下：1.采用磁控溅射沉积方法实验制备了大量铁氧体金属化的样品,优化了溅射参数,并对其进行了详细的分析表征；深入研究了420℃高温下,无铅焊料与金属化薄膜之间的反应与熔蚀过程,系统研究了生成金属间化合物的形貌特性、不同材料对耐焊性的影响等,并根据此研究结果选择了Ni-7%wt.V作为阻挡层材料。相关研究成果已发表在Journal of Electronic Materials等期刊上,具有较大的学术价值与实际应用价值,为本课题后续产业化的成功提供了理论基础。2.从表面物理学、金相学和薄膜生长理论出发,深入研究了电极层与铁氧体之界面反应机制,研究结果表明：选用Cr、Ni等活性金属作为过渡层电极,能在铁氧体界面生成了电极材料的氧化物,该层金属氧化物能大幅提高电极与铁氧体的结合力。3.铁氧体磁芯越来越微型化,难以采用掩模技术来制造微型片式电感,针对这一必然发展趋势,采用并实现了全覆盖镀膜后采用激光光刻技术来制造微型片式电感的工艺方法,提高了金属化的效率和质量。4.最终研究出适合铁氧体片式电感高温焊接工艺(420℃10秒)要求、能够进行产业化作业的多层复合膜系,作为项目组主要研究人员,参与设计并研制出了超大吞吐量的片式电感磁控溅射金属化的自动化生产专用设备,实现了产业化生产。实施结果表明：产品质量高,比印刷银浆-烧结-电镀的传统工艺降低生产成本60%,节电40%以上,生产过程无污染,实现了绿色制造,为企业创造了重大社会经济效益。相关的研究成果已获得了两项发明专利。更多还原

【Abstract】 With the rapid growth of information and communication industry, electronic components as its carrier exhibit high-speed, integrated, green trends. The study on the reliability of electronic components and electric interconnect technology has become an internationally popular field of study. Inductors are considered difficulty to be integrated, and its metallization still relies on electroplating method, which is low-efficient, high-cost and unavailable for the420℃high-temperature assembly process of winded inductors. In this paper, we investigated the metallization technology for ferrite from theory to practice. Finally, this technology has been applied to the industry process and it is the first implementation of this kind.The main efforts are listed as follows:1. We proposed a design of multi-layer composite thin film suitable for high-temperature(420℃) process. Experimental samples were prepared by magnetron sputtering deposition method. Complete industry standard test was done, and to select the optimum sputtering parameters, we studied the performance of the samples in various sputtering parameters. The thin film dissolution process is covered, including the morphology and composition of the intermetallic compound generated by the surface reaction and the impact of these products on the dissolution rate. Rising of temperature can change the reaction products, speed up the dissolution. Based on the analysis, we choose Ni-V as the barrier material. The test results proved that the composite film is valid to meet the adhesive and high-temperature resistance requirements and is suitable for large-scale production. The paper on surface reaction between SnAgCu solder and metal film at420℃high temperature was published and indexed by SCI and El.2. We studied the film growth theory, metallography and interfacial physics. In-depth study of the reaction mechanism between the electrode layer and the ferrite, quantitative indicators of lead-free solder and the metal electrode dissolution mechanism has been done. Researches show that:active metals like Cr and Ni, are capable of capturing oxygen atoms from substrate, and they are chosen as the transition material, there will be an oxide of the material at the metal-ferrite interface, it is this layer of metal oxide greatly improve the adhesion of the film. A well-designed metallization is required to provide necessary adhesion, high-temperature treatment.3. Auxiliary laser etching was first proposed to solve the problem of small-sized inductor metallization. Results of its application showed great advantages over original mask sputtering method:both in producing rate and metallization quality.4. Based on Experimental results, we designed and installed a magnetron sputtering metallization production line, completed PLC controller programming and monitoring software. The production line has been successfully put into manufacturing. The implementation showed that it has reduced costs by more than60%, and saved more than40%of the electricity compared to electrode coating. Product quality has reached the international advanced level, created significant economic benefits. Two invention patent has been published.更多还原