【作者】 洪彬；

【导师】 张连洪； 张大卫；

【作者基本信息】 天津大学 ， 机械制造及其自动化， 2012， 博士

【摘要】 空间用高压绝缘组件(简称高压组件)是行波管放大器功率传输的关键部件。在我国空间行波管放大器国产化研制过程中,经统计故障有80%是在热真空试验中发生的,而热真空试验中的故障70%以上又是由高压组件灌封气泡缺陷造成的,高压组件真空灌封技术已成为制约我国空间行波管放大器应用的瓶颈之一。为此,本文对高压组件灌封缺陷形成机理、灌封工艺及装备技术进行了系统的研究,解决了高压组件灌封不实、灌封体内部存有死空间或裂缝等灌封缺陷问题,形成了自主的高压组件真空灌封技术。论文主要研究内容和成果如下:1.针对高压组件气泡缺陷问题,在分析高压组件真空灌封气泡缺陷形成以及预防措施基础上,构建了高压组件真空灌封气泡生长模型,预测了高压组件真空灌封时的真空度。为进一步完善高压组件气泡缺陷预防手段,构建了高压组件真空灌封气泡抑制模型,分析了真空压力浸润过程气泡抑制机理,预测了高压组件真空灌封时的浸润压力。2.采用CCD摄像检测方法,对高压组件真空灌封气泡形成规律进行实验分析,为制定高压组件真空灌封中真空度等基本工艺参数提供实验依据。通过对高压组件内部电场分析,建立了脉冲交流直流并联叠加的局部放电检测方法,为高压组件灌封气泡缺陷的测试提供了检测手段。3.在高压组件灌封气泡缺陷机理及规律研究基础上,结合力学性能、热性能以及电性能等分析测试,确定了高压组件真空灌封材料;通过对高压组件灌封模具要素分析,提出了真空灌封模具精度及排气的设计准则,研制了高压组件灌封模具;结合工艺试验,确定了计量配比、混合度、脱气真空度、灌封真空度、浸润压力等真空灌封工艺参数,提出了真空灌封工艺的技术规范。4.根据高压组件真空灌封工艺的需求,集成计量、混合、灌封阀、真空脱气以及控制等真空灌封技术,研制成功高压组件真空灌封系统样机。样机经系统功能测试,各种技术指标满足设计需求,应用样机所灌封的高压组件通过了DPA、X射线以及局部放电等检测,解决了高压组件气泡缺陷等问题。本文研究的高压组件真空灌封技术,虽然其具体对象是空间用高压绝缘组件,但就其技术原理而言,也适用其它电气部件的真空灌封,具有一般性意义。更多还原

【Abstract】 High-voltage insulators for space application is the key components affecting the reliability of power transmission of the travelling wave tube amplifier (TWTA). Statistical analysis shows that 80% of the faults occurred in the thermal vacuum tests and 70% of these vacuum test faults caused by bubble defections during vacuum potting of the high-voltage insulators in China. The vacuum potting technology for high-voltage insulators has been one of the bottlenecks that block the development and application of the space TWTA in our country. Therefore, a systematic study is carried out in this dissertation on the formation mechanism of bubble defection, the process technology and the equipments of vaccum potting process, to make perfect high-voltage insulators and to meet the military standards. The contents and the main results are summarized as below.1. Based on the analysis of the bubble formation mechanism in the vacuum potting, bubble growth model in vacuum potting for high-voltage insulators is constructed, and vacuum parameter is predicted for the potting process. In order to prevent the high-voltage insulators from the bubble defections, the bubble inhibition model is constructed, bubble inhibition mechanism during impregnation process in vaccum is analysed and the impregnate pressure is predicted for the potting process.2. With CCD camera detection, the bubble formation in vaccum potting process for high-voltage insulators is analysed. Through analysing the internal electric field of the high-voltage insulators, the partial discharge (PD) detection method is established for testing of the bubble defection in high-voltage insulators.3. Potting resin material for high-voltage insulators is determined by analysing and testing of mechanical properties, thermal properties and electrical performance of candidate resins. Via analysing the factors and their functions of potting molds for the vaccum potting process, design criteria for accuracy and air exhausting of the mold are put forward, and the potting mold is further more developed. With potting process test verification, the vaccum potting process parameters, such as the metering ratio, mixing degree, degassing vacuum and potting vacuum, impregnation pressure etc., are determined. And the technical specifications are proposed.4. Based on the process reqirement analysis for vacuum potting of high-voltage insulators, the mockup of the vaccum potting system for high-voltage insulators is developed by integrating the metering, mixing, vacuum degassing and control techonolies. The mockup was validated via system function testing to meet the design requirement. The sample potted by the mockup passed the destructive physical analysis (DPA) test, X-ray test and PD test and can fulfill the production of the high-voltage insulators.The priciples and results of the dissertation can also be applied to the potting of other electrical insulators.更多还原