【作者】 于方津；

【导师】 李文杰；

【作者基本信息】 桂林电子科技大学 ， 机械工程（专业学位）， 2021， 硕士

【摘要】 芯片是集成电路的载体,在民用和军工领域有着非常广泛的应用。随着芯片性能指标的不断提高,其对检测技术的要求也越来越高。因此,研发一种高精度、快速、廉价的芯片缺陷检测设备已经成为当前热门研究的课题。在诸多技术中,融合了光学、机械、图像处理、控制等学科内容的机器视觉技术具有非接触、结构简单、价格低廉等优势,在工业缺陷检测领域备受青睐。经过调查发现针对微型芯片检测的专用镜头设计,无限远像距显微光学系统可以充分满足其应用过程,无限远像距的显微系统在意义上是一种多功能的显微镜,它可以通过外接插口以及内接插口的方式组合不同的显微镜系统,并且该显微系统成像质量较好,不会出现象面的偏移和弥散,焦距也不会影响,无限远像距在物镜和辅助物镜之间形成的平行光路可提高系统的轴向检测范围,同时也不会影响整个系统的光学质量,丰富检测设备的性能,从一定意义上可替代传统显微镜头。本课题采用显微成像的形式设计了芯片检测系统的光机结构。针对显微成像系统结构单一的不足,采用了无限远像距作为系统的基础光学结构。基于芯片分辨率以及外形尺寸要求,设计了检测光学系统中的物镜以及辅助物镜,并采用光学分析软件OSLO软件对整个光学结构进行了优化。仿真结果表明,物镜的形式为三片式照相型,辅助物镜的形式为双胶合-厚弯月型,系统分辨率为312.5lp/mm,符合分辨率为7μm的设计要求。基于蒙特卡罗分析法,对系统的中的光学元件进行公差分析,并根据分析结果分配元件公差以及确定最终的机械结构。最后,对设计的无限远像距显微光学系统进行测试。测试结果表明,所设计的芯片光机检测系统其分辨率为266lp/mm,与仿真分析相当,并满足检测需求。在设计中,第一步根据设计要求,选择并设计合适的光学部件,其中包含了显微物镜和辅助物镜的选型与设计;第二步进行整体的无限远像距光学系统的设计,第三步进行了光机结构的设计和特型显微镜的效能检验。最终确定的形式为:前组使用无限远像距三片式照相物镜;后组为f’=200mm的双胶合-厚弯月形式的辅助物镜,探测器选用光敏面尺寸为12.8mm×9.6mm的CCD工业相机,像素尺寸为6.5μm×6.5μm。更多还原

【Abstract】 Chips are integrated circuit carriers and are widely used in the civil and military fields.With the continuous improvement of chip performance indicators,the requirements for detection technology are increasing.Therefore,high precision,high speed and inexpensive chip flaw detectors attract attention.Among many technologies,machine vision technology,which integrates fields such as optics,machinery,image processing and control,has the advantages of a non-contact,simple and low-cost structure.After a survey found that in view of the special lens design micro chip detection,infinity as from video microscope optical system can fully meet the application process,from microscopic system in the sense of infinity as is a kind of multi-function microscope,it can be through an external port and inscribed interface combinations of different microscope system,and the microscopic system imaging quality is better,won’t appear like the migration and diffusion,the focal length will not affect.Infinite image distance parallel light path between the objective lens and the auxiliary lens formed axially detection range of the system can be improved,but also will not affect the performance of the optical quality of the system,the rich detection device,in a certain sense can replace conventional microscope head.In this topic,the chip inspection system is designed into an optical-mechanical structure in the form of microscopic imaging.Aiming at the deficiencies of the single structure of the microscopic imaging system,an infinite image distance is adopted as the basic optical structure of the system.At the same time,some components such as polarizers and filters can be inserted without affecting the optical quality of the entire system.Check the performance of the device.Based on chip size and resolution requirements,the objective and auxiliary objectives of the detection optics are designed and OSLO optical analysis software is used to optimize the set of optical structures.The simulation results show that the objective is of the three-part photographic type and the auxiliary objective is of the double bond thick meniscus type.The system resolution is312.5 lp / mm,which meets the 7 resolution design requirements.Based on the Monte Carlo analysis method,the analysis of the system of optical components is performed tolerances,component tolerances are allocated based on the results of the analysis and the final mechanical structure is determined.Finally,the designed infinite image distance microscopic optical system is tested.The test results show that the designed optomechanical chip detection system has a resolution of 266 lp / mm.This is equivalent to a simulation analysis and meets the detection requirements.In the design,the first step depending on design requirements,select and design suitable optical component,which includes the selection and design of the auxiliary lens and a microscope objective;second step of the overall image distance infinity optical system design,the first three-step test the effectiveness of the design and characteristics of the optical mechanism of the microscope.The final form is: the front group uses an infinite image distance three-piece photographic objective lens;the rear group is a double glued-thick meniscus auxiliary objective lens with f’=200mm,and the detector uses a CCD with a photosensitive surface size of 12.8mm×9.6mm.Industrial camera with a pixel size of 6.5μm×6.5μm.更多还原