【摘要】 环氧塑封料（EMC）在电动汽车电控系统用芯片封装中扮演着重要角色。电动汽车电控系统工作温度的不断升高对传统EMC材料的耐热稳定性提出了越来越高的要求。本文综述了国内外近年来在耐高温塑封料领域的研究进展，从耐高温树脂发展概况及其对传统环氧树脂基EMC材料的改性进展等方面进行了阐述。重点综述了双马来酰亚胺（BMI）、氰酸酯（CE）、聚苯并噁嗪（PBZ）树脂改性EMC材料以及邻苯二腈基塑封料的发展状况。最后对电动汽车电控芯片封装用耐高温塑封料的未来发展趋势进行了展望。更多还原

【Abstract】 Epoxy molding compounds(EMC) play important roles in packaging of chips for electrically controlling systems of electric vehicles(EV). The increasing working temperature of EV controlling system puts forward higher and higher requirements for the thermal stability of traditional EMC materials. In this paper, the progress on the high temperature resistant molding compounds at home and abroad in recent years was reviewed, and the development status of high temperature resistant resins and the progress of high temperature resistant resins modified traditional epoxy resin based EMC materials were described. Especially, the development status of high temperature resistant EMC materials modified by bismaleimide(BMI), cyanate ester(CE), and polybenzoxazine(PBZ) and phthalonitrile(PN) based molding compounds were reviewed. Finally, the future development trend of high temperature resistant molding compounds for packaging of electronic control chip in EV was prospected.更多还原