【作者】 张柯；

【导师】 张秋鄂；

【作者基本信息】 长春理工大学 ， 光学， 2009， 硕士

【摘要】 激光直写布线技术是随着大规模集成电路的发展而于20世纪80年代中期提出的一种新型电路板制作技术。由于具有精度高、周期短、操作方便和成本低等特点,激光直写布线技术被认为具有工业化应用前景而成为研究热点。本文分析了激光与材料作用的物理基础,实现了在玻璃基板表面制备导线及电阻元件,并系统研究了匀胶工艺参数和激光加工参数对所制备导线厚度及宽度这两个最重要物理量的影响规律。实验步骤为:通过匀胶、烘干在基板上预置好电子浆料层,然后用激光按预定轨道进行扫描,未辐照浆料区域可以用有机溶剂清洗掉,留下所要的导电图形,最后烧结固化。所用激光器为Nd:YAG激光器,聚焦后辐照预置好的导电浆料层,在玻璃基板上制备出了最小线宽为110μm的镍导线。所制备的导线表面光滑,与基板结合牢固,电阻率可达10^-4Ω·cm,导电性能优良,满足工业应用的要求。更多还原

【Abstract】 With the development of large-scale intergrated circuits, laser direct writing technology was presented as a new technology of circuit board manufacturing in the mid-1980s. With having the characteristics of high precision, short period, easy operation and low cost, laser direct writing is considered to have prospect towards industrialization, and becomes the research hotspot. In this paper, the physical foundation of reciprocity of Laser&Materials was discussed. The conductive lines and resistors were fabricated directly on glass. At the same time, the concerned fundamental technical problems were studied systematically. The effects of spin coating technological parameter and laser processing parameters on thickness and linewidth were studied systematically, which are both important parameters to characterize the conductive line quality.The first experimental procedure was spin coating and coating- drying heating ,to prepar the electronic paste, then scanned the paste according to preset orbit by laser beam. The untreated area could be cleaned by organic solvent, and the conductive patterns which we needed were left. The last procedure was sintering the patterns. According to aboveprocess, the nickel conductive lines with minimum linewidths of 110μm was fabricated onglass substrate by the use of the focused Nd:YAG laser to irradiate the conductive paste coating. The conductive lines had the smooth surface. The adhesive strength between conductive lines and substrates was strong, while the resistivity of conductive lines can reach the level of 10^-4Ω·cm on glass substrate, which could meet the demands for industrial applications.更多还原